Composition structure of heat pipe and its capillary structure

Abstract

The invention relates to a heat pipe and a capillary organization composition structure thereof. The heat pipe comprises a heat pipe main body, a capillary organization and work fluid, wherein the heat pipe main body comprises an inner wall face, the capillary organization is combined on the inner wall face, the capillary organization comprises 30 weight percentage of first capillary fine powder and 70 weight percentage of second capillary fine powder, the particle diameter of the first capillary fine powder is smaller than that of the second capillary fine powder, the work fluid is injected into the heat pipe main body, and the first fine powder and the second fine powder are evenly mixed to be sintered on the inner wall face of the heat pipe. Thus, the heat pipe can achieve the maximum work efficiency to quickly remove heat energy generated by electronic elements.

Description

technical field [0001] The present invention relates to heat pipe structure, in particular to a capillary structure of heat pipe. Background technique [0002] A general heat pipe is composed of a copper tube, a capillary wick, and a working fluid sealed in the tube. Its use method is to attach the heated end of the heat pipe to the surface of the heating electronic component. When the working fluid inside the heated end absorbs heat and vaporizes, the vapor pressure will gradually increase and flow toward the cooling end with low pressure to form a steam flow; On the other hand, when the steam releases heat at the cooling end, it will recondense into a liquid form, and then flow back to the heating end through the capillary tissue, and the heat energy generated by the electronic components will be rapidly dissipated through the repeated action of the working fluid inside the heat pipe. remove. [0003] However, since today's electronic devices are required to be thinner a...

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Problems solved by technology

[0004] As mentioned above, since the working performance of the heat pipe will be affected by the two factors of capillary pressure difference and reflux resistance, these two factors change with the pore size of the capillary structure. When the pores are small, the capillary pressure difference is large, which can drive the condensed liquid However, when the capillary pores are small, the frictional force and viscous force of the working liquid backflow increase, that is, the working liquid backflow resistance increases, resulting in a slow backflow of the working liquid, which is easy to cause the heat pipe to Dry burning phenomenon occurs at the evaporating end; similarly, when the capillary pores are large, although the working liquid is subject to small backflow resistance, the capillary pressure difference of the condensed liquid sucked into the capillary structure is reduced, reducing the return flow of the working liquid, and also making the Dry burning of the heat pipe at the evaporating end

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