Method of placing parts on printed circuit board (PCB) circuit board surfaces

Abstract

The invention discloses a method of placing parts on printed circuit board (PCB) circuit board surfaces. The method comprises the following steps: printing silica gel on part electrodes or pin surroundings which need to be pasted on a first surface of the PCB circuit board, wherein the PCB circuit board is printed with solder paste, placing on the silica gel and bonding with the parts. According to the method of placing the parts on the PCB circuit board surfaces, in placing, when a second surface of the PCB circuit board is soldered, the parts which are larger in weight, have small pads and are placed on the first surface cannot drop in reflow soldering, wherein self-weight larger than soldering tension causes dropping, and more manpower and material resources does not need to be added at the same time, so increase of production cost is reduced, later stage maintenance is facilitated. The method of placing the parts on the PCB circuit board surfaces has the advantages of facilitating model selection of the parts in surface mounted technology (SMT) processes with larger and larger paster density.

Description

technical field [0001] The invention relates to an electronic component, in particular to a method for mounting parts on the surface of a PCB circuit board. Background technique [0002] At present, in the field of surface mount technology, because users have smaller and smaller requirements for product appearance, most circuit boards (PCB) are double-sided in the surface mount process, but each circuit board (PCB) At least two times of reflow soldering are required. For some parts with large volume and small pads, if they are mounted on the BOTTOM side of the circuit board (PCB), when reflow soldering is mounted on the TOP side, when they are in the reflow area and connected to the PCB PAD When the solder joint with the part is melted, the liquid solder paste is less than the gravity of the part, so it is easy to fall into the reflow furnace when passing through the furnace. The traditional process method is to use a jig to support the production of large parts, or to poin...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for mounting parts on the surface of a PCB circuit board, which solves the problem that the parts on the first side of the current circuit board are easy to fall when the second side of the circuit board is reflow soldered

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