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Reticle assembly, a lithographic apparatus, the use in a lithographic process, and a method to project two or more image fields

A technology for lithography equipment and reticle, which is applied in microlithography exposure equipment, optomechanical equipment, photolithography process exposure devices, etc., and can solve problems such as increasing the size of reticle

Active Publication Date: 2013-06-05
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in practice, the possibility of substantially increasing the size of the reticle while maintaining the same specification of the reticle is limited

Method used

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  • Reticle assembly, a lithographic apparatus, the use in a lithographic process, and a method to project two or more image fields
  • Reticle assembly, a lithographic apparatus, the use in a lithographic process, and a method to project two or more image fields
  • Reticle assembly, a lithographic apparatus, the use in a lithographic process, and a method to project two or more image fields

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Embodiment Construction

[0024] figure 1 A lithographic apparatus according to an embodiment of the invention is schematically shown. The lithographic apparatus comprises: an illumination system (illuminator) IL configured to condition a radiation beam B (e.g., ultraviolet (UV) radiation or any other suitable radiation); a support structure or patterning device support (e.g., a mask A mold table) MT configured to support a patterning device (eg mask) MA and connected to a first positioning device PM configured to precisely position the patterning device MA according to determined parameters. The apparatus also includes a substrate table (e.g., wafer table) WT or "substrate support" configured to hold a substrate (e.g., a resist-coated wafer) W and configured for A second positioner PW for precisely positioning the substrate W is connected. The apparatus further comprises a projection system (e.g. a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam...

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Abstract

A reticle assembly for use in a lithographic process in which a first image field and a second image field are projected onto a first target portion and a second target portion on a substrate, the reticle assembly being arranged to hold a first reticle having the first image field and a second reticle having the second image field such that a distance between the first and second image fields substantially corresponds to a distance between the first and the second target portions. Embodiments also relate to a lithographic apparatus including the reticle assembly, the use in a lithographic process in which a first image field and a second image field are projected onto a first target portion and a second portion on a substrate, of a first reticle having the first image field and a second reticle having the second image field, wherein a distance between the first and second image fields substantially corresponds to a distance between the first and second target portions.

Description

technical field [0001] The present invention relates to a reticle assembly, a lithographic apparatus, the use of a first reticle and a second reticle in a lithographic process and a method for projecting two or more image fields in a single scanning movement of the lithographic process method. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. For example, lithographic equipment may be used in the manufacture of integrated circuits (ICs). In this case, a patterning device, alternatively referred to as a mask or reticle, may be used to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, comprising a portion, one or several dies) on a substrate (eg, a silicon wafer). Typically, the pattern is transferred by imaging the pattern onto a layer of radiation sensitive material (resist) provid...

Claims

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Application Information

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IPC IPC(8): G03F7/20
CPCG03F7/70425G03F7/70633G03F7/70716H01L21/682
Inventor P·范德维恩
Owner ASML NETHERLANDS BV
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