Composite build-up material for embedding of circuitry

A technology of circuits and mixtures, applied in the directions of printed circuits, printed circuits, printed circuit manufacturing, etc., can solve problems such as uneven laser ablation

Inactive Publication Date: 2013-06-05
ATOTECH DEUT GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This also results in uneven ablation by the laser

Method used

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  • Composite build-up material for embedding of circuitry
  • Composite build-up material for embedding of circuitry
  • Composite build-up material for embedding of circuitry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0143] Preparation of resin powders for layers (2) and (3)

[0144] The resin components listed in Table 1 were weighed in the amounts indicated and thoroughly mixed together in polyethylene bags.

[0145] Table 1: Components for resin powder preparation of resin layers (2) and (3)

[0146] components

Quantity (g)

Multifunctional solid epoxy resin

480

Bakelit PF 0790 K03

180

Submicron Size Silicon Oxide

338

Total:

998

[0147] Use dicyclopentadienyl-bridged polyfunctional solid epoxy resin, Bakelit PF 0790 K03, which is a phenolic-based phenolic resin (CAS-no.9003-35-4), and has a 0.3 micron average Submicron sized silica fillers in particle size and spherical particle shape are used as raw materials. The mixed dielectric components were then extruded on a 19 mm-hole, 5-zone, 24 l / d twin-screw extruder produced by OMC, Italy and equipped with a screw with maximum number of mixing elements. The barrel temperat...

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Abstract

Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).

Description

technical field [0001] The present invention relates to composite stack-up materials for use in the manufacture of printed circuit boards, IC substrates, chip packages, etc., suitable for embedding circuits to form electrical paths for signal propagation. Background technique [0002] Circuitry such as copper tracks (e.g. copper-filled microvias, trenches and pads) are mounted on one or both outer surfaces of the base material, which are then stacked and laminated to form devices such as printed circuit boards, IC substrates, chip packages Wait. Due to the continuing demand for size reduction of such devices, circuit features such as copper track width and spacing between two copper tracks must be further reduced. To achieve this goal, conventional methods for manufacturing copper tracks such as surface roughening of non-conductive substrates followed by copper deposition on the substrate surface and printing and etching steps must be replaced by manufacturing methods capab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/10H05K3/46
CPCH05K2201/029H05K3/0032H05K2201/0293H05K2201/0112H05K3/4673H05K3/0085H05K1/0313H05K2201/0195Y10T428/24967Y10T29/49155H05K3/10H05K3/46
Inventor A·布鲁德雷尔N·加尔斯特J·克雷斯M·普鲁伯斯特
Owner ATOTECH DEUT GMBH
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