Composite build-up material for embedding of circuitry

Abstract

Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer (1), a resin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).

Description

technical field [0001] The present invention relates to composite stack-up materials for use in the manufacture of printed circuit boards, IC substrates, chip packages, etc., suitable for embedding circuits to form electrical paths for signal propagation. Background technique [0002] Circuitry such as copper tracks (e.g. copper-filled microvias, trenches and pads) are mounted on one or both outer surfaces of the base material, which are then stacked and laminated to form devices such as printed circuit boards, IC substrates, chip packages Wait. Due to the continuing demand for size reduction of such devices, circuit features such as copper track width and spacing between two copper tracks must be further reduced. To achieve this goal, conventional methods for manufacturing copper tracks such as surface roughening of non-conductive substrates followed by copper deposition on the substrate surface and printing and etching steps must be replaced by manufacturing methods capab...

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