A dispensing method of heat dissipation cover adhesive

Abstract

The invention provides a distribution method of heat-radiating cover adhesive glue, which comprises the following steps of: steel mesh design and production step: designing and producing a special steel mesh outer frame and a stainless steel printing steel sheet according to the structure of a heat-radiating cover of a chip, selecting the thickness of the steel sheet according to the consumption of the glue and determining an opening structure; and opening on the steel sheet through laser cutting and connecting the outer frame with the steel sheet into a whole by adopting a wire mesh to form a special printing steel mesh; adhesive glue distribution step: upwardly putting the bonding surface of the heat-radiating cover into a mould, enabling the printing steel mesh to be aligned with the heat-radiating cover, putting the adhesive glue onto the printing steel sheet, scraping on the surface of the steel sheet by adopting a scraping knife, depositing the glue on the bonding surface of a heat-radiating fin through the opening of the steel sheet and vertically and upwardly demoulding the steel mesh to realize glue distribution. The distribution method has the beneficial effects that the adhesive glue is distributed in a steel mesh printing manner, the consumption of the adhesive glue of the heat-radiating fin is accurately controlled, the parameter adjustment time is reduced, the adhesive glue is quickly and accurately distributed through the heat-radiating cover of the chip to realize reliable bonding of the heat-radiating cover, the development time of a packaging sample is shortened, and the development cost is reduced.

Description

technical field [0001] The invention relates to the field of chip packaging, and more specifically, the invention relates to a method for distributing bonding glue for a heat dissipation cover. Background technique [0002] In the production of chip packaging, the surface of high-power chips needs to be bonded with a heat dissipation cover. The purpose of bonding the heat dissipation cover is to provide a heat dissipation path for the chip on the one hand, increase the heat dissipation area, and facilitate the heat dissipation of the chip, and on the other hand, to provide mechanical protection for the chip and prevent it from being damaged. [0003] The heat dissipation cover needs to be firmly and reliably bonded to the substrate with glue, so that the silicon chip can be in close contact with the heat sink through the heat conduction material, and the heat generated can be conducted to the heat sink through the heat conduction material to achieve good heat dissipation of ...

AI Technical Summary

Problems solved by technology

[0006] 1) It is necessary to purchase special dispensing equipment, and the investment cost is high;

[0007] 2) When bonding, the side is prone to overflow glue;

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