Stampings bonding prevention device for stamping die

Abstract

The invention discloses a stampings bonding prevention device for a stamping die and is suitable for punching of coiled materials. The stampings bonding prevention device for the stamp die comprises two rotary cylinders which are located on one side of the die, and the coiled materials go in from the side. The two rotary cylinders are tightly attached to each other and arranged up and down. Each rotary cylinder comprises an oil storage drum with two sealed ends and an oil impregnating layer which is arranged on the outer side of the oil storage cylinder. The oil impregnating layer has elasticity. A plurality of oil impregnating holes are uniformly formed in the circumferential surface of each oil storage cylinder. One ends of the oil storage cylinders are connected with a punching oil conveying system through pipelines. A damping layer with elasticity is arranged between each oil storage cylinder and each oil impregnating layer. A plurality of oil impregnating cylinders are uniformly arranged on the circumferential surface of each damping layer and embedded in each oil impregnating layer. Oil outlet holes which penetrate through the inner surface of each damping layer are formed in each oil impregnating cylinder. Kerfs which are communicated with the oil outlet holes are uniformly arranged on the circumferential surface of each oil impregnating cylinder. The stampings bonding prevention device for the stamp die can prevent stampings from bonding with the die, and therefore continuous punching can be achieved, and influence of machine halt on production efficiency is avoided. Besides, the stampings bonding prevention device for the stamp die is beneficial for prolonging service life of the die and improving punching quality of products.

Description

[0001] This application is a divisional application of the invention patent application with application number 201110413639.9. The filing date of the original application: December 13, 2011. The title of the invention of the original application: a device that can avoid the sticking of stamping die chips technical field [0002] The invention relates to stamping forming processing technology, in particular to an anti-punching chip bonding device for precision punching of lithium battery pole pieces. [0003] Background technique [0004] During the punching process of the die, a small amount of punching chips will be produced and stick to the die, especially in the process of punching materials such as aluminum or aluminum alloy, due to the high temperature at the cutting edge of the die, the aluminum punching Chips are easy to stick and adhere to the mold, resulting in burrs or even damage to the processed product, which reduces the qualified rate of the product. For prec...

AI Technical Summary

Problems solved by technology

[0009] The present invention aims to overcome the problems of easy bonding of punching chips, time-consuming mold cleaning and low production efficiency in the existing die punching technology, and provides a device that can avoid the bonding of punching chips and realize continuous punching

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