Wafer acceptance test (WAT) breakdown voltage test device and method

Abstract

The invention discloses a wafer acceptance test (WAT) breakdown voltage test device. The device comprises a discharge module, a leakage current test module, a ramp voltage test platform for testing a breakdown voltage after a semiconductor device is judged by the leakage current test module to be not short-circuited, a return test platform and a comprehensive test platform, wherein the comprehensive test platform is used for combining the ramp voltage test platform with the return test platform through the selection of a mark module, establishing an address indicating group (AIg) program for testing and observing data in the ramp voltage test platform and the return test platform at the same time. The device combines breakdown voltage test with ramp voltage test and return test and simultaneously carries out measurement, precision and Ibd setting are modified, so that the setting accuracy of the AIg program can be accurately judged, and the debugging time is shortened. Meanwhile, a plurality of groups of data are observed, so that the breakdown voltage test result is credible, the necessity of retest is reduced, and the reliability of the data and the failure characteristics of a simple structure can be directly observed.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a breakdown voltage testing device and method for wafer acceptability testing. Background technique [0002] The manufacturing process of integrated circuits can be divided into three stages: upstream, middle and downstream, including silicon wafer production; integrated circuit production; integrated circuit packaging and testing. The manufacturing process of integrated circuits is very complicated and the cost is very high, so the yield rate of manufactured products plays a decisive role. The test in the whole production process is roughly divided into three stages: the wafer acceptability test (Wafer Acceptance Test, WAT) after the integrated circuit is produced; the test before the integrated circuit packaging (Chip Package Test); Test (Final Test). [0003] The wafer acceptability test is an electrical test on the chip after the process is completed, and is used to ...

AI Technical Summary

Problems solved by technology

[0006] The present invention is aimed at the prior art, where the breakdown voltage test in the traditional WAT is a single-output test mode, and the confirmation of the data usually requires re-testing, which is not only time-consuming and labor-intensive, but also severely limited. Production efficiency, increased production cost, can no longer meet the needs of complex engineering testing and other defects Provide a breakdown voltage testing device for wafer acceptability testing

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