Hot air heating system for accurately heating target ball grid array (BGA)

Abstract

The invention relates to a hot air heating system for accurately heating a target ball grid array (BGA). An air pump is connected with a gas dryer used for eliminating water vapor generated in the compression process. A temperature controller is arranged at the front end of a hot air sprayer device and is used for carrying out temperature control on the whole system. The hot air sprayer device comprises hot air pipes and a suction nozzle air pipe, wherein the hot air pipes are used for heating gas passing through the interior of the hot air pipes, and the suction nozzle air pipe is used for enabling the BGA to be adsorbed on a suction nozzle. A gas quality flow sensor is arranged under the hot air pipes and is used for monitoring quality and flow of hot air in real time, and transmitting the quality and flow data to the temperature controller. The temperature controller is used for controlling the gas delivery value of the air pump and the heating temperature of heaters of the hot air pipes in real time according to temperature data transmitted by temperature sensors finally arranged below the BGA, and the hot air is finally spurted out through a hot air nozzle orifice. The hot air heating system is simple in structure, stable in running, capable of achieving the accurate heating to the target BGA and achieving one-off removing and welding.

Description

technical field [0001] The invention relates to a hot air heating system for realizing precise heating of a target BGA. Background technique [0002] The emergence of BGA rework workstations provides convenient conditions for the rework of components using ball grid soldering methods. The heating system of traditional BGA rework workstations mostly uses the temperature measurement of the air outlet to adjust the heating of the heater in real time. For the temperature control of the heating system, the control accuracy of this control method is low, because the temperature of the final target BGA cannot be known, and the heating is often uneven, or the phenomenon of local high and low. It will cause the components to burn out, and even cause the entire board to be unusable again. Contents of the invention [0003] In order to overcome the disadvantages of the above-mentioned prior art, the object of the present invention is to provide a hot air heating system that can accu...

AI Technical Summary

Problems solved by technology

[0002] The emergence of BGA rework workstations provides convenient conditions for the rework of components using ball grid soldering methods. The heating system of traditional BGA rework workstations mostly uses the temperature measurement of the air outlet to adjust the heating of the heater in real time. For the temperature control of the heating system, the control accuracy of this control method is low, because the temperature of the final target BGA cannot be known, and uneven heating often occurs, or the phenomenon of local high and low

Cause components to burn out, and even cause the entire board to be unusable again

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