Semiconductor Wafer Manufacturing Equipment
A manufacturing device and semiconductor technology, which is applied in the field of semiconductor wafer manufacturing devices, can solve the problems of less freedom, small coverage area, and low transfer efficiency, and achieve high product yield, improved cleanliness level, and high transfer efficiency. Effect
Active Publication Date: 2016-08-03
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0002] In the existing semiconductor wafer manufacturing equipment, the air circulation and filtration system usually adopts overall control, so the interior of the semiconductor wafer manufacturing equipment often cannot reach a high cleanliness level; secondly, these semiconductor wafer manufacturing equipment generally use a single-arm manipulator, because The single-arm manipulator can only process one wafer at the same time, with fewer degrees of freedom and a smaller coverage area, so its transfer efficiency is low; in addition, due to the unbalanced layout of the chemical gas distribution system in the existing semiconductor wafer manufacturing equipment, each The flow rate and pressure of each process chamber are not uniform, which affects the yield output of products per unit area
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[0019] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0020] Such as figure 1 As shown, the present invention provides a semiconductor wafer manufacturing device, including: at least two manipulators 1, at least one set of chemical and air source distribution system 2 and air circulation filter system 3, said air circulation filter system 3 includes a plurality of The control motor is used to achieve uniform air volume and pressure in the controlled area. Such as figure 2 As shown, the air circulation filter system is divided into three parts: front, middle and side. The two small blocks in the front are controlled by the same motor to achieve uniform air volume and pressure in the front area; the two small blocks in the ...
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The present invention relates to the field of semiconductor wafer manufacturing technologies. A semiconductor wafer manufacturing device comprises: at least two robot arms (1), at least one set of chemical and gas source distribution system (2), and multiple air circulation filter systems (3). The air circulation filter systems (3) are divided into a front region, an intermediate region, and a side region. The front region, the intermediate region, and the side region are controlled by the same motor enabling the regions to reach the homogeneous air volume and pressure. In the present invention, the air circulation filter systems are regionally controlled, so as to improve the cleanliness level of the inside the wafer manufacturing device. In addition, the present invention uses dual-section robot arms of multiple degrees of freedom, which achieves higher delivery efficiency. Moreover, the present invention uses a stable and homogeneous chemical gas and fluid distribution system, thereby achieving higher product yield per unit area.
Description
technical field [0001] The invention relates to the technical field of semiconductor wafer manufacturing, in particular to a semiconductor wafer manufacturing device. Background technique [0002] In the existing semiconductor wafer manufacturing equipment, the air circulation and filtration system usually adopts overall control, so the interior of the semiconductor wafer manufacturing equipment often cannot reach a high cleanliness level; secondly, these semiconductor wafer manufacturing equipment generally use a single-arm manipulator, because The single-arm manipulator can only process one wafer at the same time, with fewer degrees of freedom and a smaller coverage area, so its transfer efficiency is low; in addition, due to the unbalanced layout of the chemical gas distribution system in the existing semiconductor wafer manufacturing equipment, each The flow and pressure of each process chamber are not uniform, which affects the yield output of products per unit area. ...
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IPC IPC(8): H01L21/67H01L21/687
CPCH01L21/67017H01L21/67742
Inventor 赵宏宇张晓红裴立坤张豹王锐廷
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD