Unlock instant, AI-driven research and patent intelligence for your innovation.

Resin composition, prepreg and laminate using same

A technology of resin composition and prepreg, applied in application, coating, layered products, etc., can solve the problems of resin difficulty, inability to fully meet the requirements of materials, damage to moisture resistance of the composition, etc., and achieve low thermal expansion and flame retardancy Excellent performance and high adhesive strength

Active Publication Date: 2015-11-25
AIR WATER INC
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, phosphorus-containing flame retardants have the following disadvantages: toxic phosphorus compounds such as phosphine may be generated during combustion, and when a typical phosphoric acid ester is used as a phosphorus-containing compound flame retardant, the moisture resistance of the composition will be significantly impaired
However, heat resistance and flame retardancy are not necessarily the same, so it is difficult to obtain a resin composition with sufficient heat resistance and flame retardancy
[0011] Simultaneous realization of high Tg and flame retardancy is an important issue, but in the existing thermosetting resins, the two properties are opposed to each other, so there is no material that can fully meet the requirements, and the emergence of materials that can fully meet the requirements is expected

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition, prepreg and laminate using same
  • Resin composition, prepreg and laminate using same
  • Resin composition, prepreg and laminate using same

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0082] The preparation method of resin composition

[0083] As the composition of the present invention, by adding a maleimide compound (A) having at least two or more valences represented by the above-mentioned general formula [1], having at least two or more shrinkage groups in the molecule of the above-mentioned general formula [2] Glyceryl epoxy resin (B), and a phenolic compound (C) with at least 2 or more OH groups in the molecule, and a glycidyl ether compound (D) and / or a compound with at least 1 active hydrogen as needed (E) Heat and mix with necessary additive components to prepare a resin composition. The heat mixing is preferably performed at a temperature of 80 to 200° C. for about 0.1 to 10 hours. In addition, these components may be heated and mixed in an organic solvent to produce a resin varnish simultaneously with the production of the resin composition. When heating and mixing in an organic solvent, it usually takes about 0.1 to 30 hours at a temperature...

Embodiment 1

[0128] In the round bottom flask that is provided with stirrer, thermometer, cooling tube, drop into 270.0g bis(4-maleimide phenyl) methane, 82.0g naphthol aralkyl type resin [SN-485, Nippon Steel Chemical Co., Ltd. Company], 221.0g of biphenyl aralkyl type epoxy resin [NC-3000-H, Nippon Kayaku Co., Ltd.], 120.0g of methyl ethyl ketone (MEK), mixed and stirred for 2 hours after the internal temperature reached 80°C . Then, 27.0 g of reactive diluents (allyl glycidyl ether) and 12.0 g of N-methyl-2-pyrrolidone (NMP) were added, and it maintained at 80 degreeC for 4 hours.

[0129] Next, 28.0 g of NMP was added, and it maintained at 80 degreeC for 18 hours more. 200.0 g of MEK and 40.0 g of NMP were added and stirred for 2 hours to obtain a varnish (I) of a modified polyimide resin composition in a uniformly dissolved state.

[0130] The obtained varnish had a gel time of 200 seconds at 170° C., a viscosity of 120 m·Pa / s, and a resin solid content of 62% by weight.

[0131] H...

Embodiment 2

[0137] In the varnish (I) of the modified polyimide resin composition obtained by Example 1, add curing accelerator, additive (leveling agent), inorganic filler (aluminum hydroxide) and carry out uniform stirring to prepare resin varnish . The resin varnish is impregnated in 108g / m 2 (thickness about 100μm) glass cloth, dry at 160°C for 6 minutes to obtain about 200g / m 2 (thickness is about 100μm) prepreg. Lay up two sheets of this prepreg, then arrange 18μm copper foil on the upper and lower outermost layers, and shape it under the pressure of 2MPa at 180-230°C and heating conditions for 120 minutes to obtain a thickness of 0.2-0.3mm. copper-clad laminates. Table 1 also shows the test results of the laminated board thus obtained.

[0138] The composition of the cured product of the modified polyimide resin composition of the obtained laminate was 25% by weight of the resin, 17% by weight of aluminum hydroxide, and 58% by weight of the glass cloth.

[0139] Table 1 shows ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

A resin composition having high Tg (high heat resistance), low thermal expansion, and excellent flame retardancy, and being advantageous for promoting halogen-free, and having excellent adhesiveness with Cu, a prepreg obtained by impregnating it into substrate, and a composite and a laminate obtained from them. Specifically provided are a modified polyimide resin composition containing (A) a polymaleimide compound of formula [1], (B) epoxy resin having at least two glycidyl groups in the molecule of formula [2], and (c) phenolic compound having at least two OH groups in the molecule, and a prepreg obtained by impregnating the composition into the substrate, and a composite and a laminate obtained from the prepreg.

Description

technical field [0001] The present invention relates to the field of electronic materials that can be used in electronic and electrical components, printed wiring boards, semiconductor substrates, IC sealing materials, etc., and particularly relates to exhibiting excellent flame retardancy without containing halogen-containing flame retardants or phosphorus-containing flame retardants, suitable for A resin composition for printed wiring boards and semiconductor substrates requiring high heat resistance and flame retardancy, a prepreg using the resin composition, and composite materials and laminates obtained from the prepreg. Background technique [0002] In the field of electronic materials, flame retardancy is required to ensure safety against fire. Regarding laminated board materials for printed wiring boards and semiconductor substrates, there is UL94 standard of UL (Underwriters Laboratories Inc.) as its representative standard. In the vertical burning test, it is requi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00B32B15/088C08G59/20C08G59/40C08J5/24C08K5/16
CPCC09D179/08B32B15/14B32B2260/021B32B2260/046B32B2307/3065B32B2457/08C08G59/621C08J5/24C08J2379/08C08L63/00C08L63/04H05K1/0353H05K1/056Y10T428/31511Y10T428/31529C08J5/244C08J5/249C08L79/085C08L79/08B32B15/088C08K5/1515C08J2463/00
Inventor 新山哲朗曾根嘉久
Owner AIR WATER INC