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Method for cleaning silicon substrate and method for manufacturing solar cell

A cleaning method and silicon substrate technology, which is applied in semiconductor/solid-state device manufacturing, circuits, photovoltaic power generation, etc., can solve problems such as difficulty in obtaining solar cell characteristics, and achieve high photoelectric conversion efficiency

Inactive Publication Date: 2015-10-07
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, with the method of Patent Document 1, there is a problem that it is difficult to obtain stable solar cell characteristics.

Method used

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  • Method for cleaning silicon substrate and method for manufacturing solar cell
  • Method for cleaning silicon substrate and method for manufacturing solar cell
  • Method for cleaning silicon substrate and method for manufacturing solar cell

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Embodiment approach

[0034] The inventors of the present invention have intensively studied the method of Patent Document 2 in order to obtain a solar cell with high photoelectric conversion efficiency. An example of a state in which pores are formed in a silicon substrate using a metal catalyst as in the method of Patent Document 2 is shown in figure 1 . figure 1 It is an image showing the SEM (Scanning Electron Microscope) observation result of the hole 102a formed in the silicon substrate 103 using the metal catalyst 101, (a) is a plan view of the surface of the silicon substrate 103, (b) is an enlarged plan view of the hole 102a, (c ) is a sectional view of the hole 102a, and (d) is a sectional view of the internally curved hole 102a (cited by Non-Patent Document 1).

[0035] figure 2 It is a schematic diagram for explaining the formation process of the porous layer on the surface of a silicon substrate using a metal catalyst. When the silicon substrate 3 is immersed in a mixed aqueous sol...

Embodiment 1

[0127] In the solar cell of Example 1, in step S109 , the silicon substrate was immersed in ozone water having a concentration of 5 ppm at room temperature for 3 minutes to perform ozone water treatment. When producing ozone water, nitrogen is used in addition to oxygen as a raw material of ozone gas. The processing of step S109 for other solar cells will be described later.

[0128] In step S110, the excess substance used in step S109 is removed from the silicon substrate by washing the silicon substrate with water.

[0129] In step S111, use HF (50wt%): H 2 The HF aqueous solution of O=1:100 (volume ratio) removes the oxide film formed on the surface of the silicon substrate in step S109.

[0130] In step S112, the excess substance used in step S111 is removed from the silicon substrate by washing the silicon substrate with water.

[0131]In step S113, the silicon substrate is dried, and the texture formation and cleaning of the silicon substrate are completed. After tha...

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Abstract

A cleaning method of a silicon substrate includes a first step of etching a surface of a silicon substrate by a metal-ion-containing mixed aqueous solution of an oxidizing agent and hydrofluoric acid and of forming a porous layer on the surface of the silicon substrate, a second step of etching a pore of the porous layer by mixed acid mainly containing hydrofluoric acid and nitric acid and of forming texture on the surface of the silicon substrate, a third step of etching the surface of the silicon substrate on which the texture is formed with an alkaline chemical solution, and a fourth step of treating the silicon substrate etched by the alkaline chemical solution by ozone-containing water, of generating an air bubble within the pore formed in the silicon substrate, and of removing metal and organic impurities from within the pore.

Description

technical field [0001] The present invention relates to a method for cleaning a silicon substrate and a method for manufacturing a solar cell, and more particularly to a method for cleaning a silicon substrate having fine unevenness (texture) on the surface of the silicon substrate and a method for manufacturing a solar cell. Background technique [0002] So far, minute unevenness has been formed on the surface of a solar cell in order to suppress surface reflection. The incident light is multiple-reflected by the micro-concaves and convexes, and is efficiently absorbed inside the solar cell. This minute unevenness is called texture. [0003] Generally, a monocrystalline silicon solar cell forms a pyramidal texture (alkali texture) by wet etching using an aqueous alkali solution such as NaOH, KOH, and IPA (isopropyl alcohol). This technique utilizes the difference in etching speed between crystal planes, so it is effective when the substrate consists of one crystal plane l...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/306H01L21/304H01L31/04
CPCH01L21/30604H01L31/02363H01L31/18Y02E10/50H01L21/302H01L21/306
Inventor 西本阳一郎安永望松田高好
Owner MITSUBISHI ELECTRIC CORP