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Bonding alloy filamentary silver and preparation method thereof

A technology of alloy and silver wire, which is applied in the direction of electric solid devices, semiconductor devices, electrical components, etc., and can solve problems such as oxidation and bonding alloy silver wire technology differences

Active Publication Date: 2015-05-13
烟台招金励福贵金属股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] 5. The shortcomings and technical differences of the current bonding alloy silver wire
[0014] 1) Regardless of alloy silver wire or pure silver wire, due to the existence of alloy elements, short-term exposure will not cause oxidation problems, but long-term storage still has oxidation problems

Method used

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  • Bonding alloy filamentary silver and preparation method thereof
  • Bonding alloy filamentary silver and preparation method thereof
  • Bonding alloy filamentary silver and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] The bonding alloy silver wire in this embodiment is composed of metal materials with the following weight ratio: gold (Au) with a purity of 99.999wt% 8wt%, palladium (Pd) with a purity of 99.97wt% 3wt%, commercially available purity It is 99.99% oxygen-free copper (Cu) 200ppm, calcium (Ca) 80ppm, cerium (Ce) 60ppm, beryllium (Be) 8ppm, and the rest is silver (Ag) with a purity of 99.999wt%.

[0087] The product model is KT1, and its mechanical properties are shown in Table 3.

[0088] Its preparation method comprises the following steps:

[0089] 1) Smelting master alloy

[0090] a. The method of smelting Au-Be master alloy is:

[0091] The purity by weight is 99.999wt%, gold 99.20wt%-99.60wt%, and beryllium sheet 0.40wt%-0.80wt%.

[0092] i), Feeding: Put the gold that accounts for 90-95% of the total weight of gold directly into the large crucible in the furnace, and make the rest of the gold into gold foil, wrap the broken beryllium sheets in the gold foil and put...

Embodiment 2

[0126] The difference between this embodiment and embodiment 1 is:

[0127] The bonding alloy silver wire in this embodiment is composed of metal materials in the following weight ratio: gold (Au) with a purity of 99.999wt% 8wt%, palladium (Pd) with a purity of 99.97wt% 3 wt%, calcium (Ca) 80ppm, cerium (Ce) 60ppm, beryllium (Be) 8ppm, and the remaining content is silver (Ag) with a purity of 99.999wt%.

[0128] The operation process is the same as in Example 1, and the product model name is KT3, and its mechanical properties are shown in Table 3.

Embodiment 3

[0130] The difference between this embodiment and embodiment 1 is:

[0131] The bonding alloy silver wire in this embodiment is composed of metal materials in the following weight ratio: gold (Au) with a purity of 99.999wt% 8wt%, palladium (Pd) with a purity of 99.97wt% 3 wt%, calcium (Ca) 80ppm, beryllium (Be) 8ppm, and the remaining content is silver (Ag) with a purity of 99.999wt%.

[0132] The follow-up process is the same as in Example 1. The product model name is KT5, and its mechanical properties are shown in Table 3.

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Abstract

The invention relates to bonding alloy filamentary silver and a preparation method thereof, and belongs to the technical field of processing of a bonding wire. The bonding alloy filamentary silver comprises the following metal materials by mass ratio: less than 90wt% of silver, 3.0-10.0wt% of gold, and 3.0-8.0wt% of palladium; and the bonding alloy filamentary silver also comprises at least two of following metals of 10-100ppm of calcium, 4-10ppm of beryllium, 10-100ppm of cerium, and 50-500ppm of copper. The preparation method comprises the steps of 1) preparing materials; 2) smelting mother alloy; 3) continuously casting an alloy rod; 4) roughly working, intermediately drawing, and finely drawing; 5) carrying out middle annealing; 6) ultra-finely drawing; 7) finally annealing; 8) winding; and 9) packaging. The technology disclosed by the invention is specified and reasonable in design, and simple and convenient to operate; the obtained product is strong in electrical conductivity, has certain inoxidizability, good plasticity, high rupturing load, good elongation and low cost, can meet the demands of the semiconductor encapsulation industry and a light-emitting diode (LED) illumination technology on performance of the bonding alloy filamentary silver, and can be used as a substitute for a bonding alloy wire.

Description

technical field [0001] The invention relates to a bonding alloy silver wire and a preparation method thereof, belonging to the technical field of bonding wire processing. Background technique [0002] Bonding wire is a fine metal wire inner lead for electrical connection between the input / output bonding point of the chip circuit and the inner contact point of the lead frame when semiconductor devices and integrated circuits are assembled. At present, the main types are gold wire, alloy gold wire, copper wire, palladium-plated copper wire, etc. [0003] The resistivity of silver is 1.586*10 -8 μΩm has the smallest resistivity among all metals, the best electrical conductivity, and the heat dissipation of silver is better than that of gold, but pure silver wires are unstable in ball formation and easy to oxidize, so there are still great challenges in its use. In order to reduce packaging costs and meet the needs of LED bonding, bonding alloy silver wires are produced in due...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C5/06C22C1/03
CPCH01L24/43H01L2224/43848H01L2224/45139H01L2924/00011H01L2224/45144H01L2224/43H01L2224/45H01L2924/01079H01L2924/01046H01L2924/0102H01L2924/01004H01L2924/01058H01L2924/01029H01L2924/00012H01L2924/00H01L2924/01005H01L2924/01049
Inventor 范红程泰马晓霞李玉芹
Owner 烟台招金励福贵金属股份有限公司
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