Laser processing apparatus and laser processing method

A laser processing and laser technology, which is applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of increased defective rate of processing objects 40, and achieve the goals of shortening laser processing time, expanding processing depth, and reliable laser processing Effect

Active Publication Date: 2013-07-24
CHARM ENG CO LTD
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Problems solved by technology

Therefore, there is a problem that the processing defect rate of the processing

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  • Laser processing apparatus and laser processing method
  • Laser processing apparatus and laser processing method
  • Laser processing apparatus and laser processing method

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[0044] Hereinafter, the present invention will be described in detail with reference to the drawings showing specific embodiments that can implement the present invention. In order to enable those skilled in the art to fully implement the present invention, these embodiments will be described in detail. Although the various embodiments of the present invention are different, they are not mutually exclusive. For example, the specific shape, structure, and characteristics of an embodiment described herein can be implemented by other embodiments without departing from the spirit and scope of the present invention. In addition, it should be understood that the position or arrangement of the individual constituent elements in the respective disclosed embodiments can be changed without departing from the spirit and scope of the present invention. Therefore, the following detailed description is not intended to be limiting. To be precise, the scope of protection of the present invent...

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Abstract

The present invention relates to a laser processing apparatus and a laser processing method. The present invention relates to the laser processing apparatus, which is characterized by comprising: a laser unit (100) generating a laser beam (110); a wave plate (200) adjusting polarization direction of laser beam (110) from the laser unit (100); a polaroid (300) for dividing the laser beam (110) via the wave plate (200) into a first laser beam (111) and a second laser beam (112); a plurality of reflecting portions (400) reflecting the second laser beam (112); a laser beam amplification portion (500) amplifying the second laser beam (112); a focusing lens (600) for focusing a first laser beam (111) and a second laser beam (113) passing through the plurality of reflecting portions (400) and the laser beam amplification portion (500); and a processing unit for placing a processing target (700). The first laser beam (111) and the amplified second laser beam (113) are used respectively for processing different positions of the processing target (700).

Description

technical field [0001] The invention relates to a laser processing device and a method thereof. In particular, it relates to a laser processing device and method for processing different positions inside a processing object by using a first laser beam and a second laser beam amplified by a laser beam amplifier. Background technique [0002] The use of lasers for material processing is rapidly expanding across the industry. Laser processing, which has excellent characteristics in terms of precision, process flexibility, non-contact processability, and thermal influence on materials, is replacing the existing cutting process, which is to generate cuts with diamonds, etc. After cutting the wire, mechanical stress is applied to cut the object to be processed such as semiconductor wafer or glass. [0003] figure 1 It is a schematic diagram showing the structure of the conventional laser processing apparatus. [0004] refer to figure 1 After the laser beam 11 generated by the...

Claims

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Application Information

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IPC IPC(8): B23K26/00B23K26/067B23K26/06
CPCB23K26/067B23K26/073
Inventor 尹星进辛圭晟郑薰李瑾行池泳洙
Owner CHARM ENG CO LTD
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