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Chemical mechanical polishing device

A chemical machinery and equipment technology, applied in the field of chemical mechanical polishing equipment, can solve problems such as poor cleaning effect, and achieve the effects of avoiding pollution, improving cleaning effect, and avoiding secondary pollution

Active Publication Date: 2013-08-07
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Existing chemical mechanical polishing equipment has the defect of poor cleaning effect

Method used

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Embodiment Construction

[0033] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0034]In describing the present invention, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the descripti...

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PUM

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Abstract

The invention discloses a chemical mechanical polishing device. The chemical mechanical polishing device comprises a wafer box loading device, a wafer transfer device, a first mechanical arm, a chemical mechanical polishing machine, a wafer transition device, a second mechanical arm, a wafer cleaning device, a wafer brushing device, a wafer drying device and a third mechanical arm, wherein the wafer box loading device is used for storing wafers, the wafer transfer device is used for conveying wafers, the wafer transition device is used for placing wafers, the wafer cleaning device comprises a first body with a first containing cavity, a first wafer supporting assembly arranged inside the first containing cavity and a wafer cleaning assembly arranged on the first body, the wafer brushing device comprises a second body with a second containing cavity and a wafer brushing assembly and a second wafer supporting assembly which are arranged inside the second containing cavity, and the wafer drying device comprises a third body with a third containing cavity and a wafer drying assembly and a third wafer supporting assembly which are arranged inside the third containing cavity. The chemical mechanical polishing device has the advantages of being good in cleaning effect and the like.

Description

technical field [0001] The invention relates to chemical mechanical polishing equipment. Background technique [0002] The existing chemical mechanical polishing equipment has the defect of poor cleaning effect. Contents of the invention [0003] The present invention aims at solving one of the above technical problems at least to a certain extent or at least providing a useful commercial choice. To this end, an object of the present invention is to propose a chemical mechanical polishing device. [0004] In order to achieve the above purpose, a chemical mechanical polishing device is proposed according to an embodiment of the present invention. The chemical mechanical polishing equipment includes: a wafer loading device for storing wafers; a wafer transfer device for transporting wafers; for transferring wafers from the wafer loading device to the wafer transfer device A first manipulator, the first manipulator is set between the wafer box loading device and the wafer ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/04B24B37/27B24B37/34
Inventor 路新春何永勇沈攀许振杰王同庆裴召辉徐海滨张莉瑶郭振宇雒建斌
Owner TSINGHUA UNIV
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