Deposition apparatus and recovery apparatus
A recovery device and vapor deposition technology, which is applied in lighting devices, vacuum evaporation coating, sputtering coating, etc., can solve the problems of large amount of materials used, high cost, and increased original price of organic EL display devices, and achieve low cost Recycled, efficient and recycled
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Embodiment approach 1
[0078] Figure 13 A cross-sectional view showing an organic EL element constituting a display portion of an organic EL display device.
[0079] On a substrate 101 on which a thin film transistor (TFT) 100 is formed, an interlayer insulating film 102 , a first electrode 103 and an edge cover 104 are formed.
[0080] As the substrate 101 , for example, non-alkali glass, plastic, or the like can be used, and in this embodiment, non-alkali glass having a plate thickness of 0.7 mm is used.
[0081] Also, known photosensitive resins can be used as the interlayer insulating film 102 and the edge cover 104 . As said photosensitive resin, an acrylic resin, a polyimide resin, etc. are mentioned, for example.
[0082] However, in this embodiment, a photosensitive acrylic resin is used as the interlayer insulating film 102 and the edge cover 104 .
[0083] In addition, the first electrode 103 is obtained by patterning corresponding to each pixel by photolithography and etching after fo...
Embodiment approach 2
[0197] Next, based on Figure 8 , to describe the second embodiment of the present invention. In this embodiment, at least one of the small piece (not shown) and the stocker 7a is conductive, and it is different from Embodiment 1 in that it can be heated by energization, and the other structures are the same as in Embodiment 1. Same as explained. For convenience of explanation, components having the same functions as those shown in the drawings of Embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted.
[0198] Figure 8 It is a figure which shows the schematic structure of the recovery apparatus 10b.
[0199] In this embodiment, as in Embodiment 1, the plating resist and the baffle are produced by assembling small pieces in the vacuum chamber of a vacuum deposition apparatus for film formation of a hole injection layer and hole transport material.
[0200] The shape and size of the small pieces are the same as those in Embodiment ...
Embodiment approach 3
[0210] Next, based on Figure 9 and Figure 10 , the third embodiment of the present invention will be described. This embodiment differs from Embodiments 1 and 2 in that a structure capable of separating and recovering mixed vapor deposition materials is provided in a recovery device, and other structures are the same as described in Embodiments 1 and 2. For convenience of description, components having the same functions as those shown in the drawings of Embodiments 1 and 2 above are denoted by the same reference numerals, and description thereof will be omitted.
[0211] Figure 9 It is a figure which shows the schematic structure of the vacuum evaporation apparatus 1a.
[0212] In the vacuum chamber 5a of the vacuum evaporation device 1a for the luminescent layer, the vapor deposition material accommodating part 2a provided in the vapor deposition source 13a and the vapor deposition material accommodating part 2b arranged in the vapor deposition source 13b are arranged,...
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