Adhesive tape, adhering device and adhering method thereof

A tape and sticking technology, applied in lamination devices, chemical instruments and methods, packaging and other directions, can solve the problems of narrow and long tapes, difficult to locate and attach, inconvenient to tear off the release paper, inconvenient to operate, etc., and to increase the product quality. rate, and the effect of improving the quality of the paste

Inactive Publication Date: 2013-08-14
ASKEY TECH JIANGSU +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The current adhesive tapes on the touchpad and the casing of the electronic device are pasted manually, and procedures such as positioning, pasting, pressing and tearing are required manually during pasting, such as Figure 1A and Figure 1B As shown, it is a schematic diagram of the existing pasting method. First, one side of the adhesive tape 110 is attached to the casing 100 of the electronic device, and then the release paper on the other side of the adhesive tape 110 is torn off to expose the adhesive layer 111, and then 1. Paste the touchpad 200 on the adhesive layer 111 on the casing 100 of the electronic device to complete the pasting process. This method not only consumes man-hours, but also has many inconveniences in the pasting process, for example: (1) Adhesive tape 110 When attached to the case 100 of the electronic device, the tape 110 is difficult to locate; (2) Because the tape 110 is narrow and long, the tape 110 is easy to be attached and skewed; (3) Because the tape 110 is too narrow, it is easy to tear off Inconvenient release paper
It can be seen from the above that the existing adhesive tape lacks a positioning mechanism, which often leads to deviations in the position of the adhesive tape, and the adhesive tape is too narrow, resulting in the obvious inconvenience of tearing off the release paper and attaching the process, which will inevitably cause difficulties in the operation
In addition, due to the unstable quality of each product due to the manual sticking of the tape, the lack of standardized operating procedures not only increases the cost, but also affects the product
[0005] To sum up, how to provide a tape sticking technology to overcome the various defects in the above-mentioned prior art, especially because the tape is narrow and long, it is difficult to locate and attach, is the technical problem to be solved in this case

Method used

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  • Adhesive tape, adhering device and adhering method thereof
  • Adhesive tape, adhering device and adhering method thereof

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Embodiment Construction

[0046] The technical content of the present invention will be described in specific embodiments below, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied by other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0047] see figure 2 , which is an exploded schematic view of the adhesive tape of the present invention, which is used for the bonding between the touch panel and the casing of the electronic device. As shown in the figure, the adhesive tape 1 is mainly composed of an adhesive layer 10, a first release layer 11 and The second release layer 12 is composed.

[0048] In detail, the adhesive tape 1 is formed by stacking the first release...

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Abstract

The invention discloses an adhesive tape which is formed by stacking of a first de-bonding layer, an adhering layer and a second de-bonding layer. The second de-bonding layer is provided with a positioning portion, and the total area of the second de-bonding layer is larger than that of the first de-bonding layer. In addition, the invention further discloses an adhering device and an adhering method thereof. A base of the adhering device is provided with an accommodating groove and a positioning unit, and the adhesive tape is arranged in the accommodating groove of the base so as to enable the positioning portion of the adhesive tape and the positioning unit of the base to be positioned. A supporting member is provided, the first de-bonding layer is removed to expose the adhering layer, and the supporting member is adhered with the adhering layer mutually. By increasing the area of the second de-bonding layer, the problem that the shape of an existing adhesive tape is too narrow is solved, positioning fixation of the adhesive tape and the supporting member during adhering is achieved through the positioning portion, time and effort are saved, operation error rate is reduced simultaneously, and sticking quality is improved further.

Description

[0001] technical field [0002] The present invention relates to a tape pasting technology, more specifically to a tape applied to a touch panel of an electronic device, a pasting device for the tape and a pasting method thereof. [0003] Background technique [0004] The current adhesive tapes on the touchpad and the casing of the electronic device are pasted manually, and procedures such as positioning, pasting, pressing and tearing are required manually during pasting, such as Figure 1A and Figure 1B As shown, it is a schematic diagram of the existing pasting method. First, one side of the adhesive tape 110 is attached to the casing 100 of the electronic device, and then the release paper on the other side of the adhesive tape 110 is torn off to expose the adhesive layer 111, and then 1. Paste the touchpad 200 on the adhesive layer 111 on the casing 100 of the electronic device to complete the pasting process. This method not only consumes man-hours, but also has many ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D65/40B32B37/00B32B38/10B65B33/02
Inventor 黄伟姜文昌谢青峰
Owner ASKEY TECH JIANGSU
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