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A kind of method for preparing high dielectric film

A high-dielectric, composite film technology, applied in the field of electronic functional materials, can solve the problems of high dielectric breakdown strength, low dielectric constant value, difficult to process thin films, etc., and achieve excellent mechanical properties, high dielectric constant value, low cost effect

Active Publication Date: 2015-12-23
成都斯托瑞科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional dielectric materials such as ferroelectric ceramics have a high dielectric constant, but their processing temperature is high, brittle and difficult to process into thin films
Polymer dielectric materials have high dielectric breakdown strength, high flexibility, and excellent processing performance, but their dielectric constant values ​​are generally low.

Method used

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  • A kind of method for preparing high dielectric film
  • A kind of method for preparing high dielectric film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Weigh 500g polyvinylidene fluoride powder and 100g N,N-dimethylformamide ball mill and mix for 8-10h. The organic dielectric main material A is fully mixed with N, N-dimethylformyl to obtain the first slurry; the first slurry is subjected to vacuum static aging treatment for 2 to 4 hours, and the gel state composite material Film sample 1 (pure polyvinylidene fluoride film, no compounding) was obtained by heating extrusion, cooling and quenching, bidirectional film drawing, and heat setting.

Embodiment 2

[0054] Weigh 500g of polyvinylidene fluoride powder and 100g of N,N-dimethylformamide ball mill and mix for 1-4h. Make polyvinylidene fluoride powder and N,N-dimethylformyl fully mixed to obtain the first slurry; weigh 25g of polyprothoquinone and mix it with 100g of ethanol, and ultrasonically treat it for 1 to 4 hours to make polyprothoquinone Uniformly disperse in ethanol to obtain the second slurry; ball mill and mix the first slurry and the second slurry for 8-10 hours, so that the mixed slurry is fully and uniformly mixed to obtain the third slurry; vacuum the third slurry After aging treatment for 2-4 hours, the gel-state composite material was heated and extruded, cooled and quenched, bidirectionally stretched, and heat-set to obtain film sample 2 (polyvinylidene fluoride / polyhydroquinone composite film).

Embodiment 3

[0056] Weigh 500g polyethersulfone powder and 100g acetone ball mill and mix for 8-10h. The polyether sulfone and acetone are fully mixed to obtain the first slurry; the first slurry is subjected to vacuum standing and aging treatment for 2 to 4 hours, and the gel state composite material is heated and extruded, cooled and quenched, and bidirectionally drawn. Film and heat setting to obtain film sample 3 (pure polyethersulfone film, no compounding).

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Abstract

The embodiment of the invention discloses a preparation method of a high-dielectric polymer composite film. The preparation method is characterized by comprising the following steps of: sufficiently mixing a main material A and a certain quantity of first solvent to obtain a first slurry; mixing an organic dielectric material B with high dielectric constant and low loss and a certain quantity of second solvent, and dispersing the mixture to obtain a second slurry; sufficiently mixing the first slurry and the second slurry to obtain a third slurry; standing and curing the third slurry in a vacuum container to obtain a uniformly-mixed gel-state high-dielectric organic composite; and adding the gel-state high-dielectric organic composite into an extruding machine for heating and extruding, quenching a molten film through a cooling roller after the molten film is extruded, stretching the extruded cooled film in two ways through a film stretch forming machine, and finally, carrying out heat setting at the temperature of 150 DEG C to obtain the high-dielectric polymer composite film. The film has a high dielectric constant value, a high breakdown voltage value and a low dielectric loss value.

Description

technical field [0001] The invention relates to the technical field of electronic functional materials, in particular to a method for preparing high dielectric polymer composite films. Background technique [0002] Dielectric materials can be used to control / storage charge and electrical energy, and have an important strategic position in modern electronic and power systems. Traditional dielectric materials such as ferroelectric ceramics have high dielectric constants, but are difficult to process into thin films due to their high processing temperature and brittle properties. Polymer dielectric materials have high dielectric breakdown strength, high flexibility, and excellent processing performance, but their dielectric constant values ​​are generally low. [0003] In modern society, with the rapid development of informatization and microelectronics industry, the application requirements for miniaturization, integration, intelligence, high frequency and planarization of co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L81/06C08L61/16C08L27/16C08L29/04C08J5/18
Inventor 刘江萍陈骁何流王锦梅徐晓薇
Owner 成都斯托瑞科技有限公司
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