Two-way diamond wire silicon rod cutting machine

Abstract

The invention provides a two-way diamond wire silicon rod cutting machine. The two-way diamond wire silicon rod cutting machine at least comprises a machine frame, a first wire storage cylinder, a second wire storage cylinder, a diamond wire and a tension monitoring device, wherein the machine frame is provided with a cutting working table, a plurality of guide wheels and two cutting roller; the first wire storage cylinder and the second wire storage cylinder are driven by a first motor and a second motor to rotate forwards or backwards; one end of the diamond wire is wound on the first wire storage cylinder in a single-layer mode and the other end of the diamond wire is wound on the second wire storage cylinder in a single-layer mode; the tension monitoring device is electrically connected with the first motor and the second motor; the diamond wire forms a cutting net between the two cutting rollers after being guided by the plurality of guide wheels to subject workpieces to cutting operations; the tension monitoring device is used for monitoring that when the diamond wire generates tension, the first motor or the second motor drives the first wire storage cylinder or the second wire storage cylinder to absorb the tension. The two-way diamond wire silicon rod cutting machine solves the problems that the tension stability is poor, the adjustment is inconvenient, the response speed is slow and the like of a device in the prior art. Besides, by utilizing the diamond wire, the material waste is avoided, and the problems that the workpieces are inconvenient to clean, the lapping slurry is difficult to recycle and the pollution to workpieces is severe are solved.

Description

technical field [0001] The invention relates to a multi-wire cutting technology, in particular to a bidirectional diamond wire silicon rod cutting machine with double wire storage cylinders. Background technique [0002] Multi-wire cutting technology is a relatively advanced silicon wafer processing technology in the world at present. Its principle is to use a high-speed moving steel wire to drive the cutting blade attached to the steel wire to rub against hard and brittle materials such as semiconductors to achieve cutting. Purpose. Compared with the traditional knife saw blade, grinding wheel and internal circle cutting, the wire cutting technology has the advantages of high efficiency, high production capacity and high precision. [0003] During the cutting process of the workpiece, the steel wire is guided by more than a dozen wire pulleys to form a wire net on the main wire roller, and the workpiece to be processed is fed by the rise and fall of the worktable, and the ...

AI Technical Summary

Problems solved by technology

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a two-way diamond wire silicon rod cutting machine to solve the problems of poor tension stability, inconvenient adjustment and slow response speed in the prior art.

[0008] Another object of the present invention is to provide a two-way diamond wire silicon rod cutting machine to reduce the cost of materials, solve the problems of inconvenient cleaning of workpieces, difficult recovery of grinding fluid, and serious contamination of workpieces

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