Plasma processing apparatus and plasma monitoring method

A plasma and processing device technology, applied in the field of plasma processing devices, can solve the problems of inability to quickly detect the state of flameout, difficult to distinguish and monitor plasma, etc.
CN103258706AActive Publication Date: 2013-08-21TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOKYO ELECTRON LTD
Publication Date
2013-08-21

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Abstract

The invention provides a plasma processing apparatus, which can introduce microwaves in a processing container from multiple places and can monitor states of multiple plasmas generated by multiple microwaves. The plasma processing apparatus (1) has a microwave introducing device (5) for introducing microwaves into the processing container (2). The microwave introducing device (5) has a plurality of microwave through plates (73) fitted with a plurality of openings arranged in a top (11). Light emitting sensors are arranged on antenna modules (61) of the microwave introducing device respectively. The light emitting sensors detect illumination of the plasmas at a specific wavelength generated in the processing container (2) under the microwave through plates (73) through the microwave through plates (73). Detected targets are selected based on illumination intensity ratio of two plasmas generated by microwaves introduced by two adjacent microwave through plates (73).
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Description

technical field

[0001] The present invention relates to a plasma processing apparatus for processing an object to be processed using plasma, and a plasma monitoring method of the plasma processing apparatus. Background technique

[0002] As a plasma processing apparatus that performs predetermined plasma processing on a target object such as a semiconductor wafer, there is known a slot antenna that uses a planar antenna having a plurality of slots to introduce microwaves into a processing container to generate plasma. ) way of plasma processing equipment. In addition, as another plasma processing apparatus, there is known an inductively coupled plasma (ICP) type plasma processing apparatus that uses a coil-shaped antenna to introduce high-frequency waves into a processing container to generate plasma. In these plasma processing apparatuses, high-density plasma can be generated in a processing container, and oxidation processing, nitriding processing, deposition processing, ...

Claims

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