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Calibration target jig and semiconductor manufacturing equipment

A technology for semiconductors and jigs, which is applied in the field of target jigs for calibration, and can solve problems such as difficult bonding of semiconductor chips 4a

Active Publication Date: 2016-01-13
FUJI ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, even if the pyramid-shaped suction nozzle 8 is used, it is difficult to reliably bond the semiconductor chip 4a on the lead frame 2.

Method used

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  • Calibration target jig and semiconductor manufacturing equipment
  • Calibration target jig and semiconductor manufacturing equipment
  • Calibration target jig and semiconductor manufacturing equipment

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Embodiment Construction

[0068] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 This is the calibration target fixture provided by the embodiment of the present invention, in which (A) is a plan view, and (B) is a side cross-sectional view taken along the line B-B.

[0069] The calibration target jig 10 protrudes on the upper surface of a rectangular jig main body 11 of about 10 cm in width and 1 to 2 cm in length to form a cross-shaped target mark 12, and the thickness of the jig main body 11 is about 2 mm. In the jig main body 11, attachment holes 13a and 13b are respectively formed in the vicinity of the edge part in the left-right direction. The target jig 10 is used to be fixed to the later described according to the mounting holes 13a, 13b figure 2 The upper cover of the semiconductor manufacturing device (DB device) for die bonding shown is fixed in the X-Y plane of the suction nozzle that holds and transfers the semiconductor chip, the...

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PUM

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Abstract

The invention provides a semiconductor manufacturing device arranging a target jig on a calibration position for preventing dust from attaching to the front end of suction nozzle. In the target jig (10), a cross-shaped target mark (12) protrudes from the upper surface of a rectangular jig body (11), and the width of the protrusion of the target mark (12) is 50-100mu less than the size of the dust so that it faces and is in surface contact with the suction nozzle falling from above in a calibration process.

Description

Technical field [0001] The present invention relates to a calibration target jig used in the die bonding process of a semiconductor chip, and a semiconductor manufacturing device for die bonding with an automatic calibration function, and in particular to a device for reliably bonding a semiconductor chip to a lead frame A target jig for calibration, and a semiconductor manufacturing device for die bonding using the target jig. Background technique [0002] In the manufacturing process of a semiconductor device, as a semiconductor manufacturing device that continuously bonds semiconductor chips to a lead frame, a die bonding device (hereinafter, referred to as "DB device") has been used for a long time. [0003] The DB device is provided with a transfer device such as a heating table that heats the lead frame and a supply rail that continuously transfers a plurality of lead frames. In each lead frame, the solder that has been molten on the heating stage is loaded on a semiconducto...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/68H01L21/52
CPCH01L2224/75H01L2224/83192
Inventor 傅田俊男降旗博明今井诚
Owner FUJI ELECTRIC CO LTD