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A kind of polishing liquid based on metal molybdenum polishing process, its preparation method and application

A technology of polishing liquid and process, which is applied in the field of polishing liquid and polishing liquid of polishing process, can solve the problems of poor efficiency and achieve the effects of low static corrosion rate, high polishing rate and high planarization efficiency

Inactive Publication Date: 2015-12-09
FUDAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In CN102690608A, it is proposed that in the process of using hydrogen peroxide as an oxidant to polish Mo, adding a complexing agent containing ammonium ions can greatly improve the polishing rate of Mo; but only under alkaline conditions, this complex Only the mixture can improve the polishing rate of Mo
Moreover, the static etch rate and the polishing rate are close, and the efficiency is poor

Method used

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  • A kind of polishing liquid based on metal molybdenum polishing process, its preparation method and application
  • A kind of polishing liquid based on metal molybdenum polishing process, its preparation method and application
  • A kind of polishing liquid based on metal molybdenum polishing process, its preparation method and application

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Experimental program
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Effect test

Embodiment 1

[0032] Preparation of polishing solution: Potassium iodate with a concentration of 0.05 mol / L and 0.1 mol / L; SiO 5% in total weight 2 Abrasives; accounting for 0.05% of the total weight of alkylphenol polyoxyethylene ether and the rest of the water; use diluted nitric acid, potassium hydroxide to adjust the pH value to different pH values. The polishing rate and static corrosion rate of this polishing liquid are as Table 1 and figure 2 shown.

[0033] Polishing equipment and mechanical parameter settings: The polishing machine used in this embodiment is the CP-4 desktop polishing machine produced by CETR Company; the mechanical parameters are set as follows: the pressure is 2psi, the flow rate of the polishing solution is 90ml / min, and the rotational speed of the polishing head is 90rpm. The rotational speed of the polishing table was 90 rpm.

[0034] Table 1: Polishing rate and static corrosion rate of Mo in polishing solutions with different pH values ​​of 0.05 mol / L and ...

Embodiment 2

[0045] Preparation of polishing solution: potassium iodate with a concentration of 0.1 mol / L; SiO in different total weight ratios 2 Abrasives; accounting for 0.05% of the total weight of alkylphenol polyoxyethylene ether and the remainder of water; adjusting the pH value to 4 with diluted nitric acid and potassium hydroxide. The polishing rate of the polishing liquid is shown in Table III.

[0046] The polishing equipment used and process parameters are the same as in Example 1.

[0047] Table 3: The polishing rate of Mo in the polishing liquid containing 0.1 mol / L of potassium iodate and different weight ratios of abrasives

[0048] SiO 2 Abrasive weight ratio (%) 0 2 5 10 Mo polishing rate (nm / min) 16.5 36.4 52.0 55.8

[0049] It can be seen from the data in Table 3 that the polishing rate of Mo is low without adding abrasives. After adding abrasives, the polishing rate increases with the concentration of abrasives. However, when the abrasive...

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Abstract

The invention discloses a polishing solution based on polishing process of metal Mo, preparation method and application of the polishing solution. The polishing solution comprises the following components by weight percent: 0.1-10% of an oxidizing agent, 0.001-5% of surfactant, 0.01-10% of pH value regulator, 1-10% of abrasive and the balance of water, wherein the pH value of the polishing solution is 2.0-7.0; the oxidizing agent is selected from more than any one of potassium iodate, sodium iodate, calcium iodate and barium iodate. The preparation method of the polishing solution provided by the invention is simple, the polishing solution is high in polishing speed on the Mo, the static corrosion speed is low, and the polishing on the Mo has excellent planarization efficiency. The polishing solution provided by the invention can be used for polishing the Mo, the alloy of the Mo, or the compound of the Mo.

Description

technical field [0001] The invention belongs to the technical field of electronic technology and relates to a polishing solution, in particular to a polishing solution based on a metal Mo polishing process, a preparation method and an application thereof. Background technique [0002] Mo (molybdenum) is a silver-white metal with stable chemical properties, hard and tough, and a density of 10.2g / cm 3 , the melting point is 2610°C, the common valences are +2, +4 and +6, and the stable valence is +6. Mo is widely used in the electronics industry, for example, it can be used as an electrode of a thin film transistor, as a metal gate of a transistor, as a barrier layer in an integrated circuit interconnection, and the like. However, there are few research reports on Mo-based polishing fluids. [0003] In CN102690608A, it is proposed that in the process of using hydrogen peroxide as an oxidant to polish Mo, adding a complexing agent containing ammonium ions can greatly improve t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09G1/02C23F3/06
Inventor 曾旭屈新萍
Owner FUDAN UNIV
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