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Foreign matter bad point monitoring method and device

A monitoring device, poor technology, applied in the direction of electrical components, semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, etc., can solve problems such as loss of meaning, long analysis feedback cycle, waste of TFT-LCD manpower and material resources, etc. Achieve the effect of reducing manpower and material resources and shortening the cycle of analysis and feedback

Active Publication Date: 2015-03-11
HEFEI BOE OPTOELECTRONICS TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned method of monitoring defective foreign matter points is used to monitor the defective points of foreign matter in the effective display area of ​​the display screen, and the analysis results of the analysis feedback are the most direct and accurate; however, the analysis feedback cycle of the above-mentioned monitoring method is long (generally 2 weeks), and The input cost is high, and the significance for project improvement is only valid in a specific period, such as a single influencing factor continues to be the main factor; if the impact is relatively light or the impact mode is not fixed, this monitoring and analysis method loses its practical significance; Moreover, when detecting defective foreign objects in the effective display area of ​​the display screen for crack analysis, the production of TFT-LCD is still in progress, which causes a lot of waste of manpower and material resources in the TFT-LCD preparation process.

Method used

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  • Foreign matter bad point monitoring method and device
  • Foreign matter bad point monitoring method and device

Examples

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Effect test

Embodiment 1

[0045] During the processing of the large substrate, each large substrate is pre-divided with a plurality of display areas arranged in an array, and after the processing of the large substrate is completed, each display area corresponds to a display screen.

[0046] Please refer to figure 1 , this example provides a method for monitoring foreign matter defect points, including:

[0047] Step S101: Obtain the first position information of each defective foreign matter point during the processing of the large substrate and the corresponding relationship between the first position information of the defective foreign matter point and the preparation process that generated the defective foreign matter point; wherein, the large substrate is pre-divided There are multiple display areas arranged in an array.

[0048] Step S102: Acquiring the second position information of each defective foreign matter point existing in the display area of ​​one or more display areas after the proces...

Embodiment 2

[0069] Please refer to figure 2 , the present embodiment provides a monitoring device for foreign matter defects, including:

[0070] The first information acquisition module 1 acquires the first position information of each defective foreign matter point in the process of processing the large substrate and the corresponding relationship between the first position information of the defective foreign matter point and the preparation process that produces the defective foreign matter point;

[0071] The second information acquisition module 2 is used to acquire the second position information of each foreign matter defective point existing in the display area in one or more display areas of each display area after the processing of the large substrate;

[0072] The matching module 3 is configured to match the second location information acquired by the second information acquisition module 2 with the first location information acquired by the first information acquisition modu...

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Abstract

A monitoring method and monitoring device for a foreign substance bad point. The monitoring method for a foreign substance bad point comprises: acquiring first location information about each foreign substance bad point in the process of processing a large substrate, and a correlation between the first location information about the foreign substance bad point and a preparation process of producing the foreign substance bad point; pre-dividing a plurality of display screen areas arranged in an array in the large substrate; acquiring second location information about each foreign substance bad point existing in display areas of one or more display screen areas, after the processing of the large substrate is completed; and matching the second location information with the first location information, and when the second location information successfully matches the first location information, determining the preparation process for producing the foreign substance bad point by means of the correlation.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a method and a monitoring device for monitoring foreign matter defect points. Background technique [0002] At present, in the field of semiconductor processing technology, especially in the processing of thin film transistor liquid crystal display device TFT-LCD, it is very important in the entire TFT-LCD processing process to monitor and analyze the foreign matter defect points in the display area of ​​the finished display screen. link. [0003] In the TFT-LCD manufacturing process, multiple display screens are prepared on a large substrate at the same time. At present, the analysis mode for monitoring the defective foreign matter points in the display area of ​​the display screen is to follow a certain method in the finished display screen with foreign matter defective points. The percentage (generally 1% to 2%) extracts defective samples for cracking analysi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66H01L21/67G01N21/94
CPCH01L22/12
Inventor 张钟石高章飞刘俊豪
Owner HEFEI BOE OPTOELECTRONICS TECH