A kind of manufacturing method of static bending ladder circuit board
A technology of static bending and production method, which is applied in the direction of printed circuit manufacturing, printed circuit, and secondary treatment of printed circuit, etc., which can solve the problems of solder mask peeling off and easy breakage, and achieve the effect of ensuring tightness
Inactive Publication Date: 2016-03-23
SHENZHEN SUNTAK MULTILAYER PCB
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AI Technical Summary
Problems solved by technology
[0007] For this reason, the purpose of the present invention is to provide a method for manufacturing a static flex stepped circuit board to solve the problem that the current static flexed stepped circuit board is screen-printed with soft solder mask ink at the flexure, and the solder mask layer in the flexure area falls off. and the problem of easy breakage
Method used
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Effect test
Embodiment Construction
[0027] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with specific embodiments.
[0028] The present invention provides a method for manufacturing a statically bent stepped circuit board, which is mainly used to solve the problem of solder resist ink on soft printed boards being screen-printed at the flexure of the current static flexibly stepped circuit board, and there is a problem that the solder resist layer in the flexed area falls off and the Easy to break problem.
[0029] Wherein the present invention specifically adopts following steps:
[0030] a. Make a film picture with a window design, and the position of the window design corresponds to the position of the flexing area of the circuit board;
[0031] b. Make the outer layer graphics on the circuit board, and form the outer layer graphics and flexure area on the circuit board;
[0032] First, stick a dry film on the out...
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The invention discloses a method for producing a static flexible and foldable step circuit board. The method comprises steps of carrying out solder mask opening on a flexible and foldable area of the circuit board and producing a cover film counterpoint line opening, completing silk screen solder masking on positions besides the flexible and foldable area, and then finishing solder mask development; and then producing a cover film, and correspondingly fixing the cover film in the opening of the flexible and foldable area. The opening is formed in the flexible and foldable area of the circuit board, and the cover film is correspondingly fixed in the opening, is tightly pressed in the opening and is slightly bigger than the opening, so that the cover film and the opening are laminated together so as to effectively ensure the lamination tightness. Compared with the prior art, the circuit board does not have solder mask ink in the flexible and foldable area, so that a problem that a solder mask in the flexible and foldable area fell off cannot be caused; and additionally, the circuit board is assembled in a flexible and foldable manner and therefore the circuit board cannot break and can be used for substituting for a simple flexible plate to play a connecting role in outer single and double layers.
Description
Technical field: [0001] The invention belongs to the technical field of printed circuit board production, and in particular relates to a method for producing a statically bent stepped circuit board. Background technique: [0002] With the development of electronic products in the direction of lightness, thinness, shortness and smallness, in order to realize the three-dimensional assembly of electronic products and save installation space, a combination of soft and hard boards has appeared. Rigid-flex boards are printed boards in which soft boards and rigid boards are connected, and are made by interconnecting flexible substrates with rigid substrates in different areas. In the soft-hard joint area, the conductive pattern on the flexible base material and the rigid base material can be interconnected, which not only has the rigidity of a hard board for easy assembly, but also has the flexibility of a soft board for three-dimensional assembly. [0003] Since the rigid-flex bo...
Claims
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IPC IPC(8): H05K3/00H05K3/28
Inventor 张国城姜雪飞刘东韩启龙
Owner SHENZHEN SUNTAK MULTILAYER PCB