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A kind of PC thermal insulation integrated board construction method

A construction method and integrated panel technology, applied in the direction of thermal insulation, building thermal insulation materials, walls, etc., can solve the problems of heavy workload, discontinuous thermal insulation, mildew on the wall, etc., achieve high connection strength, reduce on-site workload, and smooth The effect of degree increase

Active Publication Date: 2022-08-02
SHANGHAI VANKE REAL ESTATE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there are many problems in this method: there are discontinuous thermal insulation and cold bridge problems, which affect the external thermal insulation effect, and when there is a temperature difference in the corresponding room, it is easy to form condensation, which leads to mildew on the wall; the added outer panels not only Increasing the thickness of a single component also increases the self-weight of a single component; due to the increase in self-weight, it not only affects the flexibility of component disassembly, but also increases the difficulty and cost of production and transportation of components; in addition, the increase in self-weight of a single component, It also affects the site for on-site stacking, hoisting equipment, and management requirements
[0007] At present, no effective solutions have been proposed for the problems of large on-site construction workload and discontinuous insulation in related technologies.

Method used

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  • A kind of PC thermal insulation integrated board construction method
  • A kind of PC thermal insulation integrated board construction method
  • A kind of PC thermal insulation integrated board construction method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0065] This embodiment is an exemplary embodiment of the present invention.

[0066] A PC thermal insulation integrated board construction method of the present invention comprises the following steps:

[0067] Step S202, place two adjacent PC thermal insulation integrated boards at a preset position, and form a splicing joint between the two adjacent PC thermal insulation integrated boards, wherein the PC thermal insulation integrated board includes a thermal insulation board and a wall board, and the wall board It is fixedly arranged on the inner end face of the thermal insulation board, and the distance between at least one edge of the thermal insulation board of the thermal insulation board and the edge of the wall board corresponding to the edge of the thermal insulation board is 0-600 mm;

[0068] Step S204, setting a sealing unit at the outer end of the seam;

[0069] Step S206, a fixing unit is arranged at the outer end of the splicing seam, and the fixing unit is res...

Embodiment 2

[0101] This embodiment is an exemplary embodiment of the present invention.

[0102] A PC thermal insulation integrated board construction method of the present invention comprises:

[0103] Step S302, place two adjacent PC thermal insulation integrated boards at a preset position, and form a splicing joint between the two adjacent PC thermal insulation integrated boards, wherein the PC thermal insulation integrated board includes a thermal insulation board and a wall board, and the wall board It is fixedly arranged on the inner end face of the thermal insulation board, and the distance between at least one edge of the thermal insulation board of the thermal insulation board and the edge of the wall board corresponding to the edge of the thermal insulation board is 0-600 mm;

[0104] Step S304, setting a sealing unit at the outer end of the seam;

[0105]Step S306, a fixing unit is arranged at the outer end of the splicing seam, and the fixing unit is respectively connected w...

Embodiment 3

[0131] This embodiment relates to the PC thermal insulation integrated board in Embodiments 1 to 2.

[0132] like Figures 6 to 7 As shown, the present invention provides a PC thermal insulation integrated board, which includes a thermal insulation board 101 , several anchoring elements 102 , a wall board 103 and several steel bars 104 .

[0133] The insulation board 101 is a rectangular structure, and its parameters are: the dry density of the insulation board is 160-220kg / m 3 , compressive strength ≥ 0.30mPa, vertical plate tensile strength ≥ 0.25MPa, compressive elastic modulus ≥ 20000kPa, bending load ≥ 3000N, bending deformation ≥ 6mm, volume water absorption rate ≤ 6%, thermal conductivity less than or equal to 0.054W / m·K, softening coefficient ≥ 0.8, drying shrinkage rate ≤ 0.3%, and the combustion performance level is at least Class A.

[0134] In some of the embodiments, in order to improve the strength of the thermal insulation board 101 , the thermal insulation b...

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Abstract

The invention relates to a construction method for a PC thermal insulation integrated board, which comprises placing two adjacent PC thermal insulation integrated boards at a preset position, and forming a splicing seam between the two adjacent PC thermal insulation integrated boards; A sealing unit is arranged at the outer end of the joint; a fixed unit is arranged at the outer end of the joint; an inner pouring formwork is arranged at the inner end of the joint to form a pouring space; concrete is poured into the pouring space; after a preset time, the concrete is formed Cast-in-place structure, remove the fixed unit and the cast-in-place formwork. The advantage is that using the PC thermal insulation integrated board as the external pouring formwork can not only reduce the steps of erecting external formwork and dismantling external formwork, reducing the workload on site, but also realizing continuous thermal insulation, integration of building facades and increased flatness; Compared with the traditional external thermal insulation, the thermal insulation board of the PC thermal insulation integrated board is integrated with the wall board, and the connection strength is high, and the problem of the thermal insulation board falling off will not occur for a long time after the completion of the project.

Description

technical field [0001] The invention relates to the technical field of building construction, in particular to a construction method of a PC thermal insulation integrated board. Background technique [0002] Precast concrete (PC) is usually used to prepare concrete building components, such as exterior wall panels, floor slabs, stairs, etc. Take the design and implementation process of PC exterior wall panel components as an example to illustrate. The existing PC exterior wall panel component is a structural groove with overlapping upper and lower plates at the lower part, the outer side protruding and the inner side concave. Retaining structural reinforcement, that is, between the upper PC exterior wall panel components and the lower PC exterior wall panel components, a cast-in-situ section that is cast by on-site formwork needs to be set up, so as to connect the upper PC exterior wall panel components and the lower PC exterior wall panel components. Component connection....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): E04B2/84E04B2/86E04B1/80E04B1/66E04B1/68
CPCE04B2/84E04B2/86E04B1/80E04B1/66E04B1/68
Inventor 宣刚蔡立彬孙自萍戴少卿黄海生孙栋杰余智谢奕李利江刘丙强
Owner SHANGHAI VANKE REAL ESTATE CO LTD
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