heat sink
A radiator and heat dissipation fin technology, which is applied in lighting and heating equipment, semiconductor devices of light-emitting elements, cooling/heating devices of lighting devices, etc. Effect
Active Publication Date: 2016-09-28
BEI JING DEEPCOOL SCI-TECH CO LTD
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Problems solved by technology
[0004] The purpose of the present invention is to propose a radiator, aiming to solve the problem that the fanless radiator in the prior art has poor heat dissipation effect on high-power LED light source
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[0015] The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments.
[0016] The embodiment of the present invention proposes a heat sink for cooling the light-emitting diode integrated module. Through holes are arranged in the middle of several longitudinally arranged heat dissipation fins, so that the through holes form a chimney configuration, and around the heat dissipation fins A plurality of heat dissipation fins are arranged, so that wind can enter and flow out from the through holes around the heat dissipation fins, thereby effectively accelerating the air flow in the heat dissipation fins. At the same time, pass the upper end of the heat pipe through the heat dissipation fins. When the wind enters and flows out from the through holes around the heat dissipation fins, the heat of the working medium in the heat pipe can be effectively reduced, and the heat-reduced working medium fl...
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The invention relates to a heat radiator. The heat radiator comprises a base plate and at least two heat pipes, wherein the base plate is connected with an external heat source module in a heat conductive mode, and each heat pipe is connected with the base pate in a heat conductive mode. The heat radiator is characterized by further comprising at least two longitudinally arranged heat-radiating fins, wherein each heat-radiating fin is provided with a through hole, the through holes in the longitudinally arranged heat-radiating fins form a chimney shape, at least two heat-radiating sub-fins are distributed around each heat-radiating fin, an opening is formed in each heat-radiating sub-fin, the heat pipes penetrate through the openings, and the heat of the heat pipes are taken away from the through holes by utilizing the air entering the heat radiator from the periphery of the heat-radiating fins. According to the heat radiator, the longitudinally arranged heat-radiating fins are provided with the through holes, the through holes form the chimney shape, the heat of the heat pipes are taken away from the through holes by utilizing the air entering the heat radiator from the periphery of the heat-radiating fins, the heat of the working medium inside the heat pipes is lowered, the working medium carries out heat exchange with the external heat source module after the heat of the working medium is lowered, and the temperature of the external heat source module is lowered.
Description
technical field [0001] The invention relates to the field of heat sinks, in particular to a heat sink used for cooling light-emitting diode integrated modules. Background technique [0002] In modern society, various LEDs, Light-Emitting Diodes, and light-emitting diode light sources are more and more widely used, but the efficiency of LED light sources is only about 20%, and the remaining energy is used for heat generation, so LED lights will burn during work. Generates a lot of heat. In order to ensure the normal operation of the LED chip, the heat dissipation of the LED lamp is very important, especially for the heat dissipation of the high-power LED light source. However, the current fanless heat sinks cannot support high-power LED light sources due to flow channel and space limitations. Even if they can solve the heating problem of high-power LED light sources, the heat sinks of LED light sources also have the defects of large size and heavy weight. [0003] The heat ...
Claims
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IPC IPC(8): F21V29/51F21V29/76F21V29/83F21Y115/10F21V29/74
Inventor 王逸凡
Owner BEI JING DEEPCOOL SCI-TECH CO LTD