Laser processing device and laser processing method

Abstract

PROBLEM TO BE SOLVED: To suppress a short circuit caused by excessive removal of an insulator film when a bypass wiring repairing a wiring on a liquid crystal substrate is formed.SOLUTION: In a step S1, a color filter of a passage forming the wiring repairing a defect on a substrate is removed by a high-peak-power pulsed laser beam such that a part of thickness of the color filter is left on the insulator film. In a step S2, the color filter of which the part of the thickness is left on the insulator film of the passage forming the wiring repairing the defect is removed by a CW laser beam of low peak power. In a step S3, contact processing required for the wiring is performed by a pulsed laser beam. In a step S4, CVD processing is performed by the CW laser beam to form the bypass wiring in the passage repairing the defect. The present invention is applicable to laser processing devices.

Description

technical field [0001] The present invention relates to a laser processing device and a laser processing method, and in particular to a laser processing device and a laser processing method capable of removing a color filter of a liquid crystal substrate without damaging an insulating film on the wiring and correcting defects in the wiring. Background technique [0002] In liquid crystal substrates, in the correction process of the wiring on the COA substrate (Color filter on Array) with an insulating film and a color filter on the wiring, it is usually used to irradiate the wiring connection path with a pulsed laser. On the other hand, after the color filter is removed, the wiring connection of the pasted film by CVD (Chemical Vapor Deposition) is performed. [0003] However, in this correction process, the insulating film between the color filter and the wiring is removed during the removal process of the color filter by pulsed laser, or there is not enough insulating film...

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Problems solved by technology

[0008] However, the insulating film between the color filter and the wiring that exists on the wiring of the liquid crystal substrate is smaller than the thickness of the insulating film of the lower layer, which is about a single digit, compared to the color filter that becomes the upper layer. Even if the processing conditions are set such that the color filter is removed, if the removal is performed with a pulsed laser with a high peak power, the insulating film of the lower layer may not remain due to the removal of the insulating film. In the correction of CVD processing where lines cross, a short circuit may occur at the crossing part, so it is not possible to perform highly reliable correction processing

[0009] In addition, although it is considered to use a CW (Continuous Wave) laser with a low peak energy to remove the color filter without causing damage to the insulating film, but when only using a CW laser to remove, the layer of the color filter is too thick. , so the color filter cannot be sufficiently removed

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