Substrate inspection method

Abstract

The present invention relates to a substrate inspection method. According to the above substrate inspection method, the substrate is divided into A plurality of observation areas are inspected in order, and the above substrate inspection method includes: when inspecting a plurality of observation areas in accordance with the inspection order, for the next inspection object observation area, using at least one inspection related trend information of the previous observation area , the step of predicting the relative height displacement of the inspection object observation area; the step of adjusting the height of the measurement module based on the predicted height displacement for the inspection object observation area; and using the height-adjusted measurement module to inspect the inspection object observation area A step of. In this way, the height of the measurement module related to the observation area of ​​the next inspection object is adjusted by using the height trend information of at least one previous observation area that has been inspected, so that the measurement time can be shortened.

Description

technical field [0001] The present invention relates to a substrate inspection method, and more specifically, to a substrate inspection method for improving the reliability of an inspection process for inspecting the formation state of a measurement object formed on a substrate. Background technique [0002] Generally, in order to verify the reliability of a substrate mounted with electronic components, it is necessary to check whether the fabrication of the substrate is properly performed before and after mounting the electronic components. For example, before mounting an electronic component on a substrate, it is necessary to check whether the pad area of ​​the substrate is correctly coated with lead, and after mounting the electronic component on the substrate, it is necessary to check whether the electronic component is correctly mounted. [0003] In recent years, in order to accurately measure the object to be measured formed on the substrate, a technique of measuring t...

AI Technical Summary

Problems solved by technology

Usually, the board inspection equipment has a measurable height range that can be measured. If the height deviation due to substrate bending exceeds the above measurable height range, there will be a problem that the height cannot be measured correctly.

[0006] In addition, if there is a height deviation between observation areas due to the curvature of the substrate, it is possible to use a measurement module that measures the height displacement of each observation area in advance with a separate laser rangefinder, and resets each observation area accordingly. The height method, but this method of pre-determining the height displacement will lead to the problem of increasing the board inspection time

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