Curable silicone resin composition and optoelectronic device
A technology of resin composition and silicone, which is applied in the direction of electrical solid devices, semiconductor/solid device components, electrical components, etc., can solve problems such as difficulty in preventing silver vulcanization, brightness extraction efficiency and cost impact, and achieve high resistance and difficulty cracking effect
Active Publication Date: 2013-09-18
SHIN ETSU CHEM IND CO LTD
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- Description
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- Application Information
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Problems solved by technology
This requires further protection around the LED device, negatively impacting brightness extraction efficiency and cost
The technology of the above-mentioned patent documents is difficult to prevent silver from being sulfided by SOx
Method used
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Embodiment 1
[0166] Composition (a) was prepared by mixing 100 parts of Subcomposition #1 with 10 parts of composite silicone powder (KMP-600, manufactured by Shin-Etsu Chemical Co., Ltd.) having an average particle diameter of 5 μm until uniform.
Embodiment 2
[0168] Composition (b) was prepared by mixing 100 parts of Subcomposition #1 with 10 parts of silicone resin powder (X-52-1621, manufactured by Shin-Etsu Chemical Co., Ltd.) having an average particle diameter of 5 μm until uniform.
Embodiment 3
[0170] Composition (c) was prepared by mixing 100 parts of Subcomposition #2 with 5 parts of composite silicone powder (X-52-7030, manufactured by Shin-Etsu Chemical Co., Ltd.) having an average particle diameter of 0.8 μm until uniform.
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Abstract
A curable silicone resin composition is provided comprising (A) a linear organopolysiloxane having at least two aliphatic unsaturated radicals and optionally, an organopolysiloxane of branched or three-dimensional network structure, (B) an organohydrogenpolysiloxane having at least two SiH radicals and free of aliphatic unsaturation, (C) a hydrosilylation catalyst, and (D) silicone powder having an average particle size of 0.5-100 [mu]m. The composition is suitable for LED encapsulation.
Description
technical field [0001] The present invention relates to a curable silicone resin composition and an optoelectronic semiconductor device packaged therewith. The curable silicone resin composition can be used as a material for optical devices and optical elements, an insulating material for electronic devices and electronic parts, and a coating material Wait. Background technique [0002] Epoxy resins are generally used as encapsulation materials for light emitting diode (LED) components. However, since the epoxy resin has a high modulus of elasticity, stress is generated in the epoxy resin during thermal cycles, causing a problem of breaking bonding wires due to the stress and cracking the epoxy resin. The stress applied to the LED element by the epoxy resin may cause damage to the crystal structure of the semiconductor, resulting in a decrease in luminous efficiency. In addition, since the LED element releases light and heat during long-term operation, part of the resin ar...
Claims
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IPC IPC(8): C08L83/07C08L83/04C08L83/05C08K5/5419H01L33/56
CPCC08G77/12C08G77/20C08G77/50C08L83/10C08G77/80H01L33/56C08K5/5415C08K2201/005H01L2224/48091H01L2224/45144H01L24/45H01L2224/48247H01L2924/12042H01L2924/12044H01L2924/12041H01L2924/181H01L2924/00014H01L2924/00H01L2924/00012C08L83/04C08G77/04C08G77/08H01L23/29H01L23/296
Inventor 小内谕
Owner SHIN ETSU CHEM IND CO LTD
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