Evaporation apparatus
A technology of evaporation and evaporation materials, which is applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problem that the evaporation rate cannot form the evaporation film, the characteristics of the evaporation film cannot be obtained, and the pressure sensor cannot be calculated. Problems such as the evaporation rate of evaporation materials can be solved, so as to prevent the reduction of production efficiency and the effect of preventing backflow
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Embodiment 1）
[0035] figure 1 It is a structural diagram of Example 1 of the vapor deposition apparatus of the present invention. Such as figure 1 As shown, in a vacuum chamber (vacuum tank / evaporation container) 11, there is provided a vacuum atmosphere on the surface (lower surface) of a glass substrate (an example of a member to be evaporated) 12 to evaporate particles (evaporated evaporation) plating material, such as organic EL material) evaporation chamber 13. The vacuum chamber 11 is formed with a vacuum port (not shown) for forming the vacuum chamber into a vacuum atmosphere by a vacuum unit. A workpiece holder 15 for holding the glass substrate 12 is provided on the upper portion of the vacuum chamber 11 . That is, the illustrated vapor deposition device is an upward deposition type (upward deposition) device that vaporizes particles from below toward the lower surface (surface to be deposited) of the glass substrate 12 held by the work holder 15 .
[0036] A material transfer ...
Embodiment 2）
[0058] Figure 4 It is a structural diagram of Example 2 of the vapor deposition apparatus of the present invention. In said embodiment 2, relative to figure 1 In the configuration of the vapor deposition apparatus according to the first embodiment shown, an orifice 41 is newly provided in the material delivery pipe 17 on the downstream side of the flow rate control valve 18 . Furthermore, the first pressure sensor 21 is installed on the upstream side of the material delivery pipe 17 from the orifice 41 , and the second pressure sensor 22 is installed on the downstream side of the orifice 41 .
[0059] Using the above-described structure, as in Example 1, the pressure difference (P1-P2) between the pressures measured by the first pressure sensor 21 and the second pressure sensor 22 is obtained, and the vapor deposition rate R is continuously measured. The flow rate control valve 18 is controlled to adjust the opening of the material delivery pipe 17 so that the deposition ra...
Embodiment 3）
[0062] Figure 5 It is a structural diagram of Embodiment 3 of the vapor deposition apparatus of the present invention. The vapor deposition device is, for example, a vapor deposition device that realizes co-evaporation by simultaneously forming films of two organic materials in order to improve luminous efficiency when manufacturing organic EL equipment. Of the above two organic materials, the organic material with a higher concentration when evaporated (hereinafter referred to as "material B": an example of the first vapor deposition material), and the organic material with a lower concentration when evaporated (hereinafter referred to as "material S") : The concentration ratio of the second vapor deposition material whose vapor deposition amount is smaller than that of the first vapor deposition material) is 10 to 100:1.
[0063] Such as Figure 5 As shown, instead of the material delivery pipe 17 in Embodiment 1, a branch pipe 45 is provided. The first evaporated partic...
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