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Laminated ceramic electronic component

An electronic component, multi-layer technology, applied in the direction of multi-layer capacitors, fixed capacitor components, fixed capacitor dielectrics, etc., can solve problems such as cracks, and achieve the effect of preventing cracks

Inactive Publication Date: 2013-09-18
TAIYO YUDEN KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In short, if the multilayer ceramic capacitor 10 ′ increases the delamination and residual stress due to thermal shock received during reflow soldering, etc., and generates stress that splits the interfaces BF1 and BF2 , there will be such a problem. Stress is mainly transmitted to the left and right portions of the cylindrical ceramic portion 11 a 2 , and cracks may occur in the left and right portions similarly to the multilayer ceramic capacitor 10 described above.

Method used

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  • Laminated ceramic electronic component
  • Laminated ceramic electronic component
  • Laminated ceramic electronic component

Examples

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Embodiment Construction

[0040] Figure 4 and Figure 5 A multilayer ceramic capacitor according to one embodiment of the present invention is shown. Figure 4 With figure 2 (Sa) Corresponding cross-sectional view, Figure 5 With figure 2 (Sb) Corresponding cross-sectional view. right Figure 4 and Figure 5 Among the components shown are figure 1 , figure 2 (Sa) and figure 2 For the same part as the constituent elements shown in (Sb), use the same figure 1 , figure 2 (Sa) and figure 2 The same reference signs as those used in (Sb) will be described.

[0041] This multilayer ceramic capacitor 10 - 1 includes: a substantially rectangular parallelepiped-shaped sintered chip 11 ; and a pair of external terminals 12 provided at both ends of the sintered chip 11 in the longitudinal direction. The sintered chip 11 includes: a ceramic part 11a; and a plurality (20 in the figure) of layered conductor parts 11b, which are arranged to face each other in the ceramic part 11a. The ceramic part...

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Abstract

[Problem] To provide a laminated ceramic electronic component, wherein generation of cracks in a sintered chip due to a thermal shock that is applied when reflow soldering and the like is performed can be reliably eliminated even in the case wherein the sintered chip has delamination and residual stress. [Solution] A laminated ceramic capacitor (10-1) includes a cylindrical high void ratio portion (11d) in a cylindrical ceramic portion (11a2) of a ceramic section (11a) such that the high void ratio portion is not exposed from the surface of the ceramic portion (11a), said cylindrical high void ratio portion being integrally provided with two laminated portions (11d1, 11d2), which have a void ratio higher than that of the cylindrical ceramic portion (11a2), and respectively face the left and right side ends of laminated conductor sections (11b), and two laminated portions (11d3, 11d4) facing the outer side surfaces of the two outermost laminated conductor sections (11b).

Description

technical field [0001] The present invention relates to a multilayer ceramic electronic component including a multilayer ceramic capacitor. Background technique [0002] figure 1 Shows the appearance of a conventional multilayer ceramic capacitor widely known as a multilayer ceramic electronic component, figure 2 (Sa) means along figure 1 The cross-section of the Sa-Sa line, figure 2 (Sb) means along figure 1 Cross-section of the Sb-Sb wire. Incidentally, figure 1 Among them, L represents the length, W represents the width, and H represents the height. [0003] This multilayer ceramic capacitor 10 includes: a substantially rectangular parallelepiped-shaped sintered chip 11, in which a plurality of (20 in the figure) layered conductor portions 11b are arranged facing each other in a ceramic portion 11a; and a pair of external terminals 12 provided on the ceramic portion 11a. Both ends in the longitudinal direction of the chip 11 are sintered. The ceramic portion 11a...

Claims

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Application Information

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IPC IPC(8): H01G4/12H01G4/30
CPCH01G4/12H01G4/30
Inventor 森田浩一郎今井敦史
Owner TAIYO YUDEN KK
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