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A silicon micro-parallel five-bar mechanism

A five-bar mechanism, silicon microtechnology, applied in the direction of microstructure technology, microstructure devices, microstructure devices composed of deformable elements, etc.

Active Publication Date: 2017-02-08
锦鸿宇(上海)科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Through literature review and published patent search, there are many researches on macro-scale silicon micro-mechanisms in the prior art, but there are no relevant reports on silicon micro-parallel five-bar mechanisms made of polycrystalline silicon thin films or single crystal silicon
In addition, the current MEMS micro-mechanical mechanism includes micro-actuator, micro-actuator micro-valve, micro-pump and various micro-sensor mechanisms, and the silicon micro-parallel five-bar mechanism composed of V-beam electrothermal silicon micro-actuator as the driving component did not appear

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  • A silicon micro-parallel five-bar mechanism

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Embodiment Construction

[0014] figure 1 The shown silicon micro-parallel five-bar mechanism consists of the first movable silicon micro-rod 1, the second movable silicon micro-rod 2, the third movable silicon micro-rod 3, the Four movable silicon microrods 4 are formed, between the first movable silicon microrod 1 and the second movable silicon microrod 2, between the second movable silicon microrod 2 and the third movable silicon microrod 3, and between the first movable silicon microrod 2 and the third movable silicon microrod 3. Two pairs of the three movable silicon microrods 3 and the fourth movable silicon microrods 4 constitute V-shaped beam electrothermal silicon microactuators, and the V-shaped beam electrothermal silicon microactuators are connected in series. Flexible hinges 5 are used to connect the movable silicon micro-rods and the anchor points 6, which together form a silicon-micro parallel five-bar mechanism. The reading device 7 is used to measure the micro-displacement of the sili...

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Abstract

The invention relates to a micro parallel-connection five-rod mechanism manufactured with a silicon micro machining technology. The micro parallel-connection five-rod mechanism is composed of a silicon micro moving rod part (1), a silicon micro moving rod part (2), a silicon micro moving rod part (3), a silicon micro moving rod part (4), flexible hinges (5), anchor points (6) and a reading device (7). The silicon micro moving rod part (1), the silicon micro moving rod part (2), the silicon micro moving rod part (3) and the silicon micro moving rod part (4) form V-girder-type electric heat silicon micro actuators in a paired mode. The reading device (7) is used for measuring micrometric displacement of different positions of the micro parallel-connection five-rod mechanism. The anchor points (6) are used for controlling voltage input by the outside and supporting the moving assemblies. The flexible hinges (5) are used for connection among the assemblies and the mechanism can achieve good flexibility when motion is transmitted. In order to achieve motion of the silicon micro parallel-connection five-rod mechanism, when driving voltage is exerted among the anchor points (6), the V-girder-type electric heat silicon micro actuators composed of the moving assemblies move relatively, so that the mechanism has a certain motion manner.

Description

technical field [0001] The invention relates to a silicon micro-parallel five-bar mechanism. The movable silicon micro-rod adopts silicon micro-machining technology and is made of polycrystalline silicon film or high-aspect-ratio monocrystalline silicon and other semiconductor materials. The entire structure size is between microns and submillimeters. between. Background technique [0002] Micro-electro-mechanical system Micro-electro-mechanical System, MEMS uses semiconductors as structural materials and MEMS micro-machining technology as a means to integrate micro-mechanical actuators, micro-mechanical actuators, and micro-mechanical systems such as sensing, detection, and signal processing. Circuits are integrated on the same chip, with feature sizes typically in the micron to submillimeter range. MEMS technology is an emerging technology field interdisciplinary with microelectronics, micromechanics, microscale mechanics, microoptics, materials science, physics, chemistr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B3/00
Inventor 张永宇沈雪瑾白晓丽徐雪萌张映霞唐静静
Owner 锦鸿宇(上海)科技有限公司