Microwave circuit board manufacturing method and circuit board prepared by the method

Abstract

The invention provides a manufacturing method for a microwave circuit board and a circuit board manufactured by using the same. The manufacturing method comprises the following steps: step one, providing a substrate with a copper-clad surface and setting a microwave patter manufacturing zone and a common zone at the surface of the substrate: step two: arranging a mask layer to cover the microwave patter manufacturing zone at the surface of the substrate; step three, carrying out electroplating on the surface of the substrate; step four, removing a dry film of the microwave patter manufacturing zone and carrying out mask processing on the common zone and the microwave patter manufacturing zone and exposing a microwave line manufacturing gap at the microwave patter manufacturing zone; step fifth, providing an etching solution to carry out etching on a copper layer at the bottom of the gap and removing a dry film after the etching so as to obtain a microwave line at the microwave patter manufacturing zone; step six, carrying out mask processing on the surface of the substrate and exposing a common line manufacturing gap at the common zone; and step seven, providing an etching solution to carry out etching on the copper layer at the bottom of the gap and removing a dry film after the etching so as to obtain a common line at the common zone. Therefore, a high-precision microwave circuit board is manufactured, wherein the microwave line and the common line of the circuit board have different thicknesses.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a microwave circuit board and a circuit board prepared by the method. Background technique [0002] With the rapid development of the information industry, microwave boards tend to require higher frequencies, and their requirements for the precision control range of microwave lines are getting higher and higher, from ±1mil in the early stage to ±0.8mil, and will even increase to ±0.6mil in the future or smaller. The production of microwave lines and ordinary lines on the existing microwave board is completed in one process, and the thickness of microwave lines and ordinary lines is the same, which is difficult to meet the requirements of microwave line manufacturing precision. Therefore, in this case, such high requirements cannot be met by using traditional production methods in the early stage, and new processes need to be developed to co...

AI Technical Summary

Problems solved by technology

The production of microwave lines and ordinary lines on the existing microwave board is completed in one process. The thickness of microwave lines and ordinary lines is the same, and it is difficult to meet the requirements of microwave line production accuracy.

Therefore, in this case, the use of traditional production methods in the early stage can no longer meet such high requirements, and new processes need to be developed to comply with the development trend of higher and higher line width precision.

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