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Method for detecting the cause of pcb pattern offset

A graphic and reason technology, applied in the field of detecting the cause of PCB graphic offset, can solve the problem of high cost and achieve the effect of reducing production cost

Active Publication Date: 2016-06-22
NEW FOUNDER HLDG DEV LLC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for detecting the cause of PCB graphic offset, so as to solve the problem of high cost by cutting PCB to find the cause of graphic offset

Method used

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  • Method for detecting the cause of pcb pattern offset
  • Method for detecting the cause of pcb pattern offset
  • Method for detecting the cause of pcb pattern offset

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] see figure 1 , including the following steps:

[0024] S11: detecting the deformation value of the film paper used for exposure;

[0025] S12: judging whether the deformation value exceeds a threshold;

[0026] S13: Determine whether the pattern deviation generated during the exposure of the PCB in production is related to the deformation of the film paper according to the judgment result.

[0027] In an embodiment, if the deformation value exceeds the threshold, it can be determined whether the pattern deviation generated during the exposure of the PCB during manufacturing is related to the deformation of the film paper. In this way, it is not necessary to cut the circuit board, and it can be judged that the pattern deviation generated during the exposure of the PCB during manufacturing has nothing to do with the deformation of the film paper. There is no need to cut the circuit board when judging the correlation between the pattern offset and the deformation of the...

Embodiment 2

[0029] see figure 2 , embodiment two comprises the following steps:

[0030] S21: Detect the difference in the distance between two points in the graphic on the film paper before and after exposure, and use the difference as a deformation value.

[0031] The detected difference includes the following two methods:

[0032] Detecting the first difference in the distance between two points in the PAD pad pattern used for signal transmission in the film before and after exposure, using the first difference as the deformation value;

[0033] Or, detecting a second difference in distance between two points in the PAD pad pattern used for alignment in the film paper before and after exposure, and using the second difference as the deformation value.

[0034] see image 3 , there are multiple PAD pad patterns for signal transmission in the film, such as image 3 The pad pattern 32 in the above can measure the first difference between the distances between the two points before an...

Embodiment 3

[0068] see Figure 4 , including the following steps:

[0069] S41: Detect the deformation value of the film paper used for exposure, the deformation value includes a first difference value and a second difference value;

[0070] Detecting the first difference in the distance between two points in the PAD pad pattern used for signal transmission in the film before and after exposure, using the first difference as the deformation value;

[0071] Detecting a second difference in distance between two points in the PAD pad pattern used for alignment in the film paper before and after exposure, and using the second difference as the deformation value.

[0072] For the detection process, refer to the steps in Example 2.

[0073] S42: Using the second difference as a threshold, judging whether the first difference exceeds the threshold;

[0074] S43: Determine whether the pattern deviation generated during the exposure of the PCB in process is related to the deformation of the fil...

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Abstract

The invention provides a method for detecting causes of PCB pattern offset, which comprises the steps of detecting a deformation value of film paper used for exposure; judging whether the deformation value exceeds a threshold value or not; and determining whether the pattern offset generated in the board manufacturing and exposure process of a PCB is related to the deformation of the film paper or not according to the judgment result. The measured deformation value of the film paper used in the exposure process of the circuit board is adopted and the pattern offset is determined to be unrelated with deformation of the film paper through variation of the deformation value, thereby overcoming problems that the pattern offset is determined to be related with the film paper or not through cutting the circuit board in the prior art and that the cost is high, and then achieving the effect of reducing the production cost.

Description

technical field [0001] The invention relates to the field of printed circuit boards (PCB), in particular to a method for detecting the cause of PCB graphic offset. Background technique [0002] In the production process of PCB printed circuit boards, it will include several steps such as graphic drawing, graphic transfer, etching, and drilling. The manufacturing accuracy of the PCB in each step will be affected by the accuracy of the equipment and the deformation of the product itself. For example, in the process of graphic transfer, the position of the graphic will be affected by the deformation accuracy of the film paper during the resting time and the alignment accuracy of the exposure machine. Influence; in the process of drilling, it will be affected by the drilling position accuracy of the drilling machine. [0003] During the production process, due to the impact of the above-mentioned precision, the position of the graphics on the produced PCB is shifted. The reason...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B21/00G01B21/32
Inventor 封伟
Owner NEW FOUNDER HLDG DEV LLC