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Window Ball Grid Array Package Structure

A ball grid array and packaging structure technology, applied in electrical components, electric solid state devices, circuits, etc., can solve the problem that the double-layer ball grid array packaging structure cannot be perfectly solved, such as mold flow and line punching.

Active Publication Date: 2016-08-03
NAN YA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of the fact that the current background technology cannot perfectly solve the problem of mold flow punching in the double-layer ball grid array packaging structure, the main purpose of the present invention is to provide a novel double-layer ball grid array packaging structure, in which Special bonding pad and bonding wire design can avoid punching problems in the molding process while maintaining good molding quality

Method used

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  • Window Ball Grid Array Package Structure
  • Window Ball Grid Array Package Structure
  • Window Ball Grid Array Package Structure

Examples

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Embodiment Construction

[0030] Hereinafter, preferred embodiments of the present invention will be illustrated with illustrations. First, please also refer to image 3 and Figure 4 , which respectively depict a top view of a double-layer ball grid array package structure according to a preferred embodiment of the present invention and the following image 3 Cross-sectional view taken along section line B-B'. Such as image 3 As shown, the windowed ball grid array package structure of the present invention is mainly composed of a loading board 200, a lower chip 210, and an upper chip 220, and the lower chip 210 and the upper chip 220 can be DRAM memory chips . Wherein, the package carrier 200 is a window type ball grid array package carrier with a narrow window opening 202 in the middle, which is designed to allow the bonding wires formed in the subsequent wire bonding process to pass therethrough. A row of first bonding pads 212 and a row of second bonding pads 222 are respectively provided in ...

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Abstract

The invention discloses a window type ball grid array packaging structure which comprises a carrier plate, a lower layer chip and an upper layer chip. The carrier plate is provided with a narrow window opening. The lower layer chip is provided with an array of connecting pad which is exposed out of the narrow window opening. The upper layer chip is provided with the array of connecting pad which is vertical to the arrangement direction of the connecting pad on the lower layer chip.

Description

technical field [0001] The present invention relates to a packaging structure, in particular to a back-to-back double-layer window ball grid array (wBGA) packaging structure, which has a special arrangement of bonding pads and bonding wires to avoid the problem of wire punching. Background technique [0002] In order to achieve higher storage capacity in a limited area, the dynamic random access memory (Dynamic Random Access Memory, DRAM) architecture began to develop towards three-dimensional stacked packaging technology (3Dstackedpackage). The principle of this packaging technology is to combine multiple interconnected Access chips (die) are stacked on a single package carrier, so that several times the storage capacity can be achieved within the same area range. [0003] In the packaging structure, the chip's input / output (I / O) must be electrically interconnected with the external package, and most of them connect the pads on the chip to the package substrate by wire bond...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/065H01L23/488
CPCH01L2224/05553H01L2224/73215H01L2224/73265H01L2924/15311
Inventor 陈逸男徐文吉叶绍文刘献文
Owner NAN YA TECH