Camera module, manufacturing method thereof and handheld communication device adopting camera module

Abstract

A camera module comprises a base and a circuit board, wherein the base is provided with a first opening end and a second opening end opposite to the first opening end; the second opening end is covered with the circuit board; the circuit board comprises a substrate, a conducting layer and an anti-welding layer which are overlapped sequentially; the size of the conducting layer is smaller than or equal to that of the substrate; a space exists between the periphery of the anti-welding layer or the periphery of the conducting layer and the corresponding periphery of the substrate; the second opening end and the substrate are made of thermoplastic plastics; a molecular structure of a material of the substrate is identical or similar to that of a material of the second opening end; the wall thickness of the second opening end is smaller than the space between the periphery of the anti-welding layer or the periphery of the conducting layer and the periphery of the substrate; and the second opening end is directly welded with a marginal area on the surface, opposite to the second opening end, of the substrate through ultrasonic waves. The camera module is smaller in tilt error and can be manufactured cleanly and conveniently. The invention further provides a manufacturing method of the camera module and a handheld communication device adopting the camera module.

Description

【Technical field】 [0001] The invention relates to an image acquisition device, in particular to a camera module, a manufacturing method thereof, and a handheld communication device using the camera module. 【Background technique】 [0002] In the traditional technology, the connection plate of the cell-phone camera module 10 (CCM, cell-phone camera module) and the base 11 are fixedly connected by glue. Such as figure 1 As shown, the connection plate is a double-sided circuit board as an example. The substrate 12a of the double-sided circuit board 12 is an FR4 epoxy resin cloth laminated board, both sides are plated with copper 12b, and the outer surface is covered with an ink layer 12c (coverlay). Glue 13 is coated between the base 11 and the ink layer 12c to securely connect the base 11 and the circuit board 12 . [0003] However, traditional camera modules have the following defects: [0004] (1) Since the glue 13 is colloidal body with certain fluidity, a small amount of...

AI Technical Summary

Problems solved by technology

[0004] (1) Since the glue 13 is a colloidal body with certain fluidity, a small amount of glue 13 will overflow after pressing the base 11, which will easily pollute the camera module and affect the shooting effect of the camera module

[0005] (2) There is a certain thickness after the glue 13 dries

Images