7results about How to "Guarantee direction" patented technology

The utility model discloses a kind of wire feeding devices for motor stator winding, including pay-off device, the outer wall of the top side of pay-off device is slidably connected with locking slide block device, the pay-off device side is provided with wire feeding device, the bottom of wire feeding device is provided with support frame structure, the outer wall of support frame structure top side is fixedly connected with wire feeding plate, the outer wall of wire feeding plate side is provided with laser detection device, the outer wall of wire feeding plate side is provided with signal receiving plate, the outer wall of wire feeding plate side is provided with direction-adjusting pulley, the outer wall of wire feeding plate side is provided with tension detection device. The utility model can effectively fix coil in central position, can rotate copper wire stably, effectively prevent copper wire excessive rotation, copper wire is placed and conveniently taken down, equipment structure is simple and efficient, bearing capacity is strong, applicable to different thick and thin wire diameter copper wire material, can adjust the tension of copper wire, guarantee the direction of copper wire outlet, can detect the presence or absence of copper wire, can guarantee copper wire output tension size.

The invention provides a cross-layer annotation correction and real-time rendering method and application thereof, and belongs to the technical field of digital pathological image processing. According to the method, the problems of labeling dislocation, editing distortion and large-point-set rendering lagging during switching of the multi-focal-plane slices are solved. The method is characterized by comprising the following steps: determining interlayer offset parameters of each focal plane, and carrying out associative storage with focal plane identifiers; anchoring an original focal plane and storing original geometric data when the label is created; when the target focal plane is switched, cross-layer mapping is carried out according to the relative offset parameters, and geometric semantic stability is kept for different labeling types; a rendering complexity index is calculated, hierarchical simplified rendering is executed in a continuous interaction stage, and high-precision display is recovered after interaction is stable; and after editing, reversely writing the target geometric data back to the original focal plane coordinate system. According to the method, cross-layer accurate correction and real-time smooth interaction of the labels are realized, and pathological diagnosis is effectively assisted.

The utility model discloses a strip assembly module based on zero point positioning, include: bottom plate, assembly component and positioning component, assembly component includes frame body, positioning component includes first zero point positioner and second zero point positioner, the base of first zero point positioner and the base of second zero point positioner are located on the same end surface of bottom plate, and the positioning end of first zero point positioner and the positioning end of second zero point positioner are all with the same end surface of frame body detachable connection connection. The utility model solves the technical problem of the positioning precision of traditional strip assembly module deficiency, reaches the technical effect of improving the positioning precision of strip assembly module.

The utility model relates to the technical field of die stamping feeding, and discloses a feeding device for continuous stamping, which comprises a base, the upper side of the base is fixedly connected with a limiting table, two sides of the limiting table are respectively provided with a sliding groove, the inner sides of the two sliding grooves are jointly connected with a pushing table in a sliding mode, and one end of the pushing table is provided with an adaptive groove. The upper side of the push table is provided with an adaptive groove feeding mechanism used for loading materials and parts in the adaptive groove, one side of the base is provided with a die stamping mechanism used for conducting stamping forming on the materials and parts, and one side of the adaptive groove is provided with an adaptive groove discharging mechanism used for pushing the materials and parts obtained after stamping forming out of the adaptive groove. The electric cylinder pushes the push table to do reciprocating motion, when the adaptive groove is aligned to the lower portion of the feeding barrel, the function of automatically loading and feeding materials is completed under the action of gravity, and the automatic feeding device is simple in structure, high in punching precision and high in practicability.

The invention provides a wafer-level acoustic function testing method and a supporting substrate, and relates to the technical field of wafer-level testing. The method comprises the following steps: firstly, providing an acoustic sensor wafer of which the surface is provided with a protection structure, and thinning the acoustic sensor wafer; a supporting substrate is provided, and the acoustic sensor wafer and the supporting substrate are bonded through a bonding material to form a bonded wafer; wherein the supporting substrate is provided with a through hole window and a first slotting structure, the position of the through hole window corresponds to the position of a functional area of a wafer, and the position of the first slotting structure corresponds to the position of a cutting channel of the wafer; then the bonding wafer is placed on the cutting workpiece, and the protection structure on the surface of the bonding wafer is removed; cutting the substrate of the acoustic sensor wafer along the cutting channel until the bonding material or the supporting substrate is exposed; and finally, the bonded wafer is taken down from the cut workpiece, and a wafer-level acoustic function test is carried out. According to the scheme of the invention, the method has the advantages of acoustic fidelity, wafer-level operation robustness and inter-chip acoustic isolation.

The invention belongs to the technical field of laser application, and relates to a femtosecond laser processing method based on micro-nano array attachment, which comprises the following steps of: 1) acquiring a three-dimensional curved surface workpiece to be processed; 2) extracting a target curved surface on the surface of the three-dimensional model, performing discretization processing, and generating a triangular patch mesh model; 3) performing shape fidelity mapping to a two-dimensional plane domain to obtain a two-dimensional plane model; 4) importing a two-dimensional processing array and carrying out Boolean intersection operation on the two-dimensional processing array to obtain a public area of the two-dimensional plane model and the two-dimensional processing array; 5) performing triangulation processing to obtain a plane region before inverse mapping; 6) mapping to a three-dimensional space to obtain an attached and segmented three-dimensional model; 7, a laser machining path is generated, and femtosecond laser machining is conducted on the three-dimensional curved surface workpiece to be machined through the laser machining path. According to the femtosecond laser machining method, the calculation complexity can be reduced, the expression accuracy of the two-dimensional micro-nano array attachment pattern boundary in the three-dimensional space can be improved, and different machining requirements can be flexibly met.

The invention discloses a cable laying device for electric power construction, which comprises a frame and a power source in the frame, and further comprises a synchronous gathering type pre-embedded assembly, the synchronous gathering type pre-embedded assembly comprises a double-head motor, rotating shafts are arranged at two ends of the double-head motor, a first belt wheel is arranged at one end of each rotating shaft, a rear plate is arranged on the other side of the frame, and the rear plate is arranged on the other side of the frame; a triangular support is arranged at the bottom of the rear plate, a second belt wheel is arranged on one side of the axle, and a belt surrounds the surfaces of the first belt wheel and the second belt wheel. Packing augers are reversely arranged on the two sides of the surface of the axle respectively, the two ends, away from the axle, of the packing augers are larger, and the portions, close to the center of the axle, of the packing augers are smaller. The synchronous gathering type embedded assembly synchronously utilizes the rotating effect of a double-head motor on a roller transmission conveying cable, rotating torque is transmitted to the surface of an auger rod in a belt transmission mode, and an auger on the surface of the auger rod is of a gathering type structure with a large outer ring and a small inner ring. And silt which is dug just now is continuously conveyed into the foundation pit from outside to inside.