4results about How to "Guarantee direction" patented technology

The invention provides a cross-layer annotation correction and real-time rendering method and application thereof, and belongs to the technical field of digital pathological image processing. According to the method, the problems of labeling dislocation, editing distortion and large-point-set rendering lagging during switching of the multi-focal-plane slices are solved. The method is characterized by comprising the following steps: determining interlayer offset parameters of each focal plane, and carrying out associative storage with focal plane identifiers; anchoring an original focal plane and storing original geometric data when the label is created; when the target focal plane is switched, cross-layer mapping is carried out according to the relative offset parameters, and geometric semantic stability is kept for different labeling types; a rendering complexity index is calculated, hierarchical simplified rendering is executed in a continuous interaction stage, and high-precision display is recovered after interaction is stable; and after editing, reversely writing the target geometric data back to the original focal plane coordinate system. According to the method, cross-layer accurate correction and real-time smooth interaction of the labels are realized, and pathological diagnosis is effectively assisted.

The utility model discloses a strip assembly module based on zero point positioning, include: bottom plate, assembly component and positioning component, assembly component includes frame body, positioning component includes first zero point positioner and second zero point positioner, the base of first zero point positioner and the base of second zero point positioner are located on the same end surface of bottom plate, and the positioning end of first zero point positioner and the positioning end of second zero point positioner are all with the same end surface of frame body detachable connection connection. The utility model solves the technical problem of the positioning precision of traditional strip assembly module deficiency, reaches the technical effect of improving the positioning precision of strip assembly module.

The invention provides a wafer-level acoustic function testing method and a supporting substrate, and relates to the technical field of wafer-level testing. The method comprises the following steps: firstly, providing an acoustic sensor wafer of which the surface is provided with a protection structure, and thinning the acoustic sensor wafer; a supporting substrate is provided, and the acoustic sensor wafer and the supporting substrate are bonded through a bonding material to form a bonded wafer; wherein the supporting substrate is provided with a through hole window and a first slotting structure, the position of the through hole window corresponds to the position of a functional area of a wafer, and the position of the first slotting structure corresponds to the position of a cutting channel of the wafer; then the bonding wafer is placed on the cutting workpiece, and the protection structure on the surface of the bonding wafer is removed; cutting the substrate of the acoustic sensor wafer along the cutting channel until the bonding material or the supporting substrate is exposed; and finally, the bonded wafer is taken down from the cut workpiece, and a wafer-level acoustic function test is carried out. According to the scheme of the invention, the method has the advantages of acoustic fidelity, wafer-level operation robustness and inter-chip acoustic isolation.

The invention belongs to the technical field of laser application, and relates to a femtosecond laser processing method based on micro-nano array attachment, which comprises the following steps of: 1) acquiring a three-dimensional curved surface workpiece to be processed; 2) extracting a target curved surface on the surface of the three-dimensional model, performing discretization processing, and generating a triangular patch mesh model; 3) performing shape fidelity mapping to a two-dimensional plane domain to obtain a two-dimensional plane model; 4) importing a two-dimensional processing array and carrying out Boolean intersection operation on the two-dimensional processing array to obtain a public area of the two-dimensional plane model and the two-dimensional processing array; 5) performing triangulation processing to obtain a plane region before inverse mapping; 6) mapping to a three-dimensional space to obtain an attached and segmented three-dimensional model; 7, a laser machining path is generated, and femtosecond laser machining is conducted on the three-dimensional curved surface workpiece to be machined through the laser machining path. According to the femtosecond laser machining method, the calculation complexity can be reduced, the expression accuracy of the two-dimensional micro-nano array attachment pattern boundary in the three-dimensional space can be improved, and different machining requirements can be flexibly met.