A method for forming pcb board pattern and its automatic optical inspection equipment

Abstract

The invention discloses a PCB pattern forming method. The method includes the following steps: (1) pattern transfer: displaying an exposed pattern to be detected on a PCB through a pattern transfer technology, (2) automatic optic inspection: delivering the PCB with the pattern to be detected to an automatic optic inspection device, carrying out photographic type scanning on the surface of the PCB through a photographic device under irradiation of a light source device to acquire an identifiable pattern, carrying out automatic identification on the identifiable pattern through the automatic optic inspection device, comparing the pattern to be detected with a standard pattern which is stored in a system of the automatic optic inspection device and meets imaging requirements to detect defects or errors of the pattern to be detected, determining the PCB as disqualified if the defects or errors exist, and determining the PCB as qualified if the defects or errors do not exist, (3) etching forming: carrying out line etching on the PCB which is determined as qualified through detection to obtain a PCB according with the standard pattern. The PCB pattern forming method reduces the rejection rate of PCBs and can save production rate.

Description

technical field [0001] The invention relates to the technical field of PCB product detection, in particular to a method for forming a PCB pattern and automatic optical detection equipment used therein. Background technique [0002] The PCB board generation process includes a graphics forming step. In this step, the semi-finished PCB board should be inspected to determine whether there are defects or errors in the graphics. The current graphics forming process: [0003] For positive images: pattern transfer → pattern electroplating → etching → automatic optical inspection [0004] For negative graphics: graphics transfer→etching→automatic optical inspection. [0005] In the prior art, the inspection of pattern errors and defects on the copper surface of semi-finished PCB boards is generally carried out by automatic optical inspection equipment (AOI) after the circuit is formed. That is, after the etching step, the automatic optical inspection equipment is used to perform au...

AI Technical Summary

Problems solved by technology

That is, after the etching step, the automatic optical inspection equipment is used to perform automatic optical inspection to determine the defects or errors of the PCB board graphics. AOI is to identify the board surface to be tested by collecting the light reflected from the copper surface of the PCB board to determine the defects or errors. The exposure pattern 1 generated after the dry film is exposed will cause chromatic aberration. The current AOI cannot identify the chromatic aberration, and cannot identify the defects of the copper surface pattern on the PCB after exposure. More and more PCB demanders do not allow copper on the PCB On the surface, repair the PCB board with circuit defects after the graphics are formed, because this will cause open circuit gaps on some copper surface lines on the PCB board surface, resulting in the scrapping of the product, resulting in the loss of production costs

At present, there is no technology and equipment that can check the integrity of graphics before they are formed

Images