Sealed circuit board printing plate
A circuit board and sealing technology, applied in printed circuit, printed circuit manufacturing, electrical components, etc., can solve problems such as poor tinning, poor sealing, product scrapping, etc., and achieve the effect of avoiding production quality problems
Inactive Publication Date: 2013-11-20
WUXI YUJI TECH
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- Description
- Claims
- Application Information
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Problems solved by technology
At present, during the printing process of circuit boards, double-sided tape is usually used to paste the fixing pins and plastic edge strips on the seat surface of the base. When the fixing pins need to be removed after the process is completed, the double-sided The residual glue of the surface glue; when the double-sided printing of the circuit board is carried out, these residual glues are easy to stick to the surface of the circuit board facing the base, which will cause problems such as poor tinning. It needs to be pointed out that the phenomenon of residual glue overflow between the bottom of each needle body and the bottom plate is easy to occur, and the sealing performance is poor
Method used
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Embodiment Construction
[0015] Such as figure 1 As shown, the sealed printed circuit board disc according to the embodiment of the present invention includes a chassis 1, a pinhole 6 is opened vertically downward at the center of the chassis 1, and a flat needle body 3 is inserted into the pinhole 6, and a flat needle body 3 is inserted in the center of the chassis 1. A number of positioning pins 2 are evenly distributed on the periphery of the flat top pin body 3, and these positioning pins 2 are distributed in a circular array with the flat top pin body 3 as the center point, and the top of each positioning pin 2 has a triangular top 5 with a triangular cross-section;
[0016] A bottom plate 4 is laid horizontally on the lower bottom of the chassis 1, and the bottom surface of each positioning pin 2 and the flat top pin body 3 is closely attached to the upper surface of the bottom plate 4. The thickness of the bottom plate 4 is 0.9mm, and each positioning pin 2 and flat top pin body 3 The distance ...
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The invention discloses a sealed circuit board printing plate, which comprises a base plate, wherein the central part of the base plate is provided with a pin hole; a pin body with a flat top is inserted inside the pin hole; a plurality of positioning pins are uniformly distributed on the periphery of the pin body with the flat top; a base plate is horizontally laid on the lower bottom surface of the base plate; the lower part of the base plate is provided with a plurality of flitch plates from the top down in sequence; a circle of sealed plates is additionally arranged on the periphery of the base plate; and the base plate is wrapped inside the sealed plate by the sealed plate. The sealed circuit board printing plate has the beneficial effects that defective gum can be prevented from leaving on the surface of a base, and the production quality problem possibly caused by the defective gum can be avoided; the sealed circuit board printing plate has the advantages of being convenient to disassemble and assemble, and convenient to clean, and being beneficial for improving the circuit board printing efficiency and the like; the multifunction aim of the printing base plate can be conveniently realized.
Description
technical field [0001] The invention relates to the technical field of printing, in particular to a sealed circuit board printing disc. Background technique [0002] Printing technology is the entire process of visual and tactile information printing and reproduction. It is a technology that reproduces art, text, and images in batches on demand through planning, photography, word processing, art design, editing, color separation, plate making, printing, and post-press molding. Printed circuit boards have developed from single-layer boards to double-sided boards, multi-layer boards, and flexible boards, and are constantly developing in the direction of high precision, high density, and high reliability, continuously reducing volume, reducing costs, and improving performance. The development trend of printed circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, thin wire, small pitch, high reliability, multi-layer...
Claims
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Login to View More IPC IPC(8): H05K3/00H05K3/12
Inventor 鲍洪生
Owner WUXI YUJI TECH