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Shield with half-cut structure, method and mold for forming same

A shielding and half-cutting technology, applied in the direction of magnetic/electric field shielding, electrical components, etc., can solve the problem of difficult removal of shielding parts, and achieve the effect of compact structure, high control precision and easy control

Active Publication Date: 2016-12-28
NINGBO XINGRUI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The problem solved by the invention is that it is difficult for the shielding element with a half-cut structure in the prior art to satisfy the problem that it has good shielding performance and can be easily dismantled

Method used

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  • Shield with half-cut structure, method and mold for forming same
  • Shield with half-cut structure, method and mold for forming same
  • Shield with half-cut structure, method and mold for forming same

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Embodiment Construction

[0027] In order to describe in detail the technical content, structural features, achieved objectives and effects of the present invention, the following will describe in detail in conjunction with embodiments and accompanying drawings.

[0028] See Figure 3 to Figure 5 , The method of the present invention for forming the shield 1 with the half-cut structure 11 includes the following steps: A), making the die punch 2 and the cushion block 3 have an interference fit, and the fit interference C is greater than zero; the die punch 2 and the cushion The initial state of block 3 is as image 3 As shown; B), so that the metal part is located between the die punch 2 and the cushion block 3, set the punching depth H of the die punch 2, and the metal part is punched by the die punch 2 to form the half-cut structure 11 , The shield body 12 and the shield 1 of the dense extruded layer 13. The dense extruded layer 13 is connected to the shield body 12 and the half-cut structure 11 by the d...

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Abstract

The invention discloses a shielding element with a half cutting structure as well as a method and a mold for forming the shielding element. The method comprises the following steps that A) a mold punch is in interference fit with a pad block, and the fit interference quantity is greater than zero; B) a metal element is positioned between the mold punch and the pad block, the punching depth of the mold punch is set, the metal element is punched by the mold punch for forming a shielding element with a half cutting structure, a compact extrusion layer and a shielding element body, the compact extrusion layer is connected with the shielding element body and the half cutting structure, is in a flat plate shape and is provided with a surface vertical to the punching direction of the mold punch, when the mold punch reaches the punching depth, and one part of the compact extrusion layer and the pad block and one part of the mold punch form a laminate structure. Because the mold punch and the pad are in interference fit, the shielding element disclosed by the invention can realize the function that the local half cutting structure can be easily dismounted, but cannot easily fall like the half cutting structure formed by tearing surfaces in the prior art, and the shielding effect of the shielding element is good.

Description

Technical field [0001] The present invention relates to a method of stamping a shielding member, in particular to a method of forming a shielding member with a half-cut structure, and also relates to a mold for processing a shielding member with a half-cut structure and a shielding member with a half-cut structure. Background technique [0002] Electronic products such as mobile phones, personal digital assistants (PDAs), and palmtop computers all have circuit boards and shields. The shield surrounds the circuit board to achieve a shielding effect. The existing shield is an integral structure formed by integral stamping. The disadvantage of the integral structure is that after the product is assembled, if the performance test of the electronic product does not meet the standard, it is impossible to open the shield and adjust the corresponding components without damage. Therefore, the integral structure shield can only be used for the shielding of electronic components with stabl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00B21D28/02B21D28/14
Inventor 刘宏波刘武斌范立明
Owner NINGBO XINGRUI ELECTRONICS TECH
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