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Micro plastic forming demolding device and forming method under high strain rate

A technology of high strain rate and demoulding device, which is applied in welding equipment, laser welding equipment, metal processing equipment, etc., can solve the problems of low utilization rate, difficult forming accuracy, increased resistance, etc., and achieve high energy utilization rate, The effect of fast demoulding speed and high strength of formed parts

Inactive Publication Date: 2013-11-27
JIANGSU UNIV
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  • Application Information

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Problems solved by technology

However, none of the papers involves the research on the release performance of the soft film on the workpiece. The thickness of the soft film is much larger than that of the workpiece, which will cause increased resistance during the forming process, and a large part of the energy will be absorbed by the soft film. The utilization rate is not good. high
Moreover, it is difficult to precisely control the forming accuracy of the soft film as a die

Method used

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  • Micro plastic forming demolding device and forming method under high strain rate
  • Micro plastic forming demolding device and forming method under high strain rate

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Embodiment Construction

[0025] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0026] The structure of a microplastic forming demoulding device under a high strain rate of the present invention is as follows figure 1 As shown, it includes a constrained layer 1, a flying piece 2 attached to the lower surface of the constrained layer 1, a mold 6, a foil plate 4 placed on the upper surface of the mold 6, a flying cavity 3 between the constrained layer 1 and the foil plate 4, and the foil plate A soft film 5 is also arranged between 4 and the mold 6 , and the thickness of the soft film 5 is smaller than that of the foil plate 4 . The size of the mold 6 is on the order of millimeters, the thickness of the foil plate 4 is tens of microns to one millimeter, and the thickness of the soft film 5 is several microns to tens of microns. The soft film 5 is arranged close to the upper surface of the mold 6 .

[0027] The constrained layer 1 is glas...

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Abstract

The invention discloses a micro plastic forming demolding device and forming method under the high strain rate. The device comprises a restraint layer, a fly sheet attached to the lower surface of the restraint layer, a mold, a foil board arranged on the upper surface of the mold, and a flight cavity formed between the restraint layer and the foil board, wherein a soft film is arranged between the foil board and the mold, and the thickness of the soft film is smaller than that of the foil board. The mold is millimetre-sized, the thickness of the foil board ranges from dozens of micrometers to one millimeter, the thickness of the soft film ranges from several micrometers to dozens of micrometers, and the soft film is tightly attached to the upper surface of the mold. The micro plastic forming demolding device has the advantages of being high in energy utilization rate, intensity of formed pieces, forming accuracy and demolding speed, replaceable in the mold (female mold), particularly suitable for rapid forming of workpieces under the high strain rate, and the like.

Description

technical field [0001] The invention relates to a demoulding method and device, in particular to a rapid demoulding method and device used in the micro-forming process of a foil plate under high strain rate. Background technique [0002] Microplastic forming technology refers to the technology of using plastic deformation to produce parts with sub-millimeter dimensions at least in the two-dimensional direction. With the rapid development and gradual practical application of MEMS, the demand for micro components is also increasing. Microplastic forming technology has become one of the key technologies for large-scale production of MEMS parts due to its advantages of simple process, high production efficiency, low cost, and high strength of formed parts. [0003] Traditional microplastic forming is performed at a low strain rate, while microforming technology under high strain rate in the field of thin plate forming is receiving more and more attention because of its grain re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/42
Inventor 刘会霞张强沈宗宝顾春兴袁耀强陆萌萌王霄
Owner JIANGSU UNIV