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Precision sensor of micro spring-like structure

A technology of micro springs and sensors, applied in the field of sensors, can solve the problems of large size and low precision, and achieve the effect of small size, precise positioning, and change of design size

Active Publication Date: 2013-11-27
无锡微泰传感封测技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention proposes a precision sensor with a micro-spring structure, which solves the problems of large volume and low precision of the resistance strain gauge sensor in the prior art

Method used

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  • Precision sensor of micro spring-like structure

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Embodiment Construction

[0017] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0018] like figure 1 As shown, in the present embodiment, the precision sensor with micro-spring structure includes a nut, a base, a MEMS capacitive sensor, a micro-sensing head and a lead wire; the nut wherein is a lower-end opening part made of a cylindrical side wall and a top cover, and the top A through hole is provided in the middle of the cover; threads are respectively provided on the nut and the base;

[0019] The MEMS capacitive sensor is located on the ...

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Abstract

The invention provides a precision sensor of a micro spring-like structure. The precision sensor comprises a nut, a base, an MEMS capacitive sensor, a micro sensor head and leads, wherein the MEMS capacitive sensor sequentially comprises a lower electrode plate, insulating media, micro springs and an upper electrode plate from bottom to top, and the upper electrode plate is fixed to the insulating media through the micro springs. After force is exerted onto the micro sensor head, the upper electrode plate of an internal MEMS capacitor and the micro springs of the internal MEMS capacitor are driven, therefore, the capacitance is changed, finally, conversion from a force value to the capacitance value is achieved, and the weight of a sensed object is obtained. According to the micromechanical system, the design size is effectively changed, the size of the sensor is made to be smaller, and the sensor is made to be more precise.

Description

technical field [0001] The invention relates to the field of sensors, in particular to a precision sensor with a microspring structure. Background technique [0002] At present, most of the load cells commonly used in the world are resistive structures, which are measured by resistance strain gauges. The strain gauge structure has insurmountable defects in low-range precision measurement: the strain gauge needs deformation space and cannot be reduced in size; at the same time, the temperature drift of the strain gauge is insurmountable and affects the measurement accuracy, especially for ultra-precision measurement. A higher level of precision. [0003] The present invention adopts a capacitive structure: the sensing part of the structure is a micro-spring capacitive structure manufactured by MEMS (Micro-Electro-Mechanical Systems, Micro-Electro-Mechanical Systems) technology, and the transmission of the weight signal of the measured object is realized through the change of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01G3/04
Inventor 李桂新
Owner 无锡微泰传感封测技术有限公司
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