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Thickness meter

A technology of film thickness meter and film thickness, which is applied in the direction of instruments, measuring devices, optical devices, etc., can solve the problems of affecting the measurement results, lowering the measurement accuracy, and reducing the light intensity of the optical path transmission, and it is difficult to achieve the measurement results and the measurement accuracy. high effect

Active Publication Date: 2016-03-23
CSMC TECH FAB2 CO LTD
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Problems solved by technology

[0003] However, during the use of the film thickness meter, the surface of the focusing mirror 124, the collecting mirror 126 and the folding mirror 128 in the beam adjustment box 122 will be polluted due to the corrosive gas generated on the surface of the wafer 110 to be tested after the corrosion process. , so that the light intensity transmitted by the optical path is reduced, which affects the measurement results and the measurement accuracy becomes lower

Method used

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Embodiment Construction

[0019] Please refer to figure 2 In one embodiment, a film thickness meter for measuring the thickness of a film on a wafer 210 is provided, the film thickness meter includes a measuring beam generator for generating a measuring beam, an optical system, a processing device and a carrying measuring beam generator, An optical system, a carrying frame of the processing device, the optical system transmits the measuring beam generated by the measuring beam generator to the film on the wafer 210, and transmits the measuring beam reflected by the film on the wafer 210 to the processing device, The processing device calculates the thickness of the film on the wafer 210 after processing the light beam from the optical system. The carrier frame is provided with a wafer carrier 220, the optical system includes a light beam adjustment box 240, the beam adjustment box 240 is arranged on the top of the wafer carrier 220 and forms a gap with the wafer carrier 220, the wafer carrier A gas f...

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Abstract

A film thickness measuring instrument for measuring film thickness of a wafer (210), an airflow generator is set on one side of a beam adjusting box (240) and a wafer supporting platform (220) of the film thickness measuring instrument, the airflow generator is used for generating airflow between the beam adjusting box (240) and the wafer supporting platform (220), The airflow blows away the volatilizing gas from the wafer (210), and avoids or reduces the volatilizing gas from the wafer (210) entering the beam adjusting box (240), therefore, lens in the beam adjusting box (240) will not be easily polluted, the measuring result will not be affected, the measuring precision will be improved.

Description

technical field [0001] The invention relates to a measuring device, in particular to a film thickness meter for measuring the thickness of a wafer film. Background technique [0002] Please refer to figure 1 , In the field of semiconductor manufacturing, the thickness of the film on the wafer needs to be measured during the wafer manufacturing process, and a film thickness meter is used at this time. A commonly used film thickness gauge includes a measuring light generator, an optical system and a processing device. The measuring light generator generates a light beam which is transmitted to the optical system. The optical system mainly includes an optical cable 112, a polarizer 114, a slit 116, a light beam adjusting box 122, a collecting reflector 124 arranged in the light beam adjusting box 122, a collecting mirror 126 arranged in the light beam adjusting box 122, The folding mirror 128 , the analyzer 132 and the light detector 134 inside the box 122 are adjusted. Aft...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/06
CPCG01B11/0616
Inventor 惠俊杰
Owner CSMC TECH FAB2 CO LTD
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