Copper foil roughness loss modeling method and sheet electrical parameter extraction method and device

Abstract

The invention discloses a copper foil roughness loss modeling method as well as a method and a device for extracting electric parameters of plates. According to the invention, electric parameter measured frequency varied curve, in which copper foil roughness loss is not substituted, of a test board for one type of plates is compared with an electric parameter simulated frequency varied curve assigned with a roughness parameter, so that the variance deviation generated to electric parameters at each frequency point due to the copper foil roughness loss can be estimated, and furthermore statistic modeling is realized by virtue of curve fitting of the variance deviation, so that a copper foil roughness loss frequency varied curve can be obtained. Compared with mathematical modeling, the adopted statistic modeling has the advantages that the obtained copper foil roughness loss frequency varied curve can relatively truly reflect the loss of practical plate production due to the copper foil roughness. Correspondingly, when the electric parameters of the plates are extracted, the copper foil roughness loss frequency varied curve can be obtained by utilizing statistic modeling, so as to determine the substituted copper foil roughness loss, so that more accurate electric parameters can be obtained.

Description

technical field [0001] The invention relates to testing technology, in particular to a copper foil roughness loss modeling method, a plate electrical parameter extraction method, a copper foil roughness loss modeling device and a plate electrical parameter extraction device. Background technique [0002] PCB is an important carrier for high-speed signal transmission. When high-speed signals are transmitted through the copper foil of the PCB, in addition to the loss caused by the copper foil itself, the material medium of the PCB will also cause loss to the high-speed signal. The dielectric loss is usually The loss caused by copper foil is greater. Therefore, the industry standard defines two electrical parameters, Dk (DielectircConstant, dielectric constant) and Df (DisssipationFactor, loss factor or loss angle), to measure the electrical properties of PCB boards. Correspondingly, for each PCB board material, its electrical performance can be estimated by extracting the abo...

AI Technical Summary

Problems solved by technology

[0006] When using the method of substituting the copper foil roughness loss, although the two electrical parameters Dk and Df obtained by using the S3 algorithm involve the loss caused by the copper foil roughness to the PCB board, the substituted copper foil roughness loss It is obtained based on pure mathematical modeling, and pure mathematical modeling is not only complicated to implement, but also relies solely on theoretical derivation, so the resulting copper foil roughness loss cannot truly reflect the copper foil roughness The actual loss of the PCB board, therefore, there is still a certain deviation in the final electrical parameters Dk and Df

[0007] It can be seen that no matter which way the S3 algorithm is used, the existing technology cannot obtain accurate electrical parameters Dk and Df

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