Plasma machining device
A processing equipment and plasma technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of complex loading process and reduce the processing efficiency of plasma processing equipment, so as to simplify the loading and unloading process, avoid adverse effects, The effect of reducing processing difficulty and manufacturing cost
Active Publication Date: 2013-12-04
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
[0010] It can be seen from the above that the existing plasma processing equipment needs the thimble 131 and the thimble drive motor to place the wafer on the upper surface of the electrostatic chuck 12, and the loading process is complicated, thereby reducing the processing efficiency of the plasma processing equipment
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[0033] In order for those skilled in the art to better understand the technical solutions of the present invention, the plasma processing equipment provided by the present invention will be described in detail below in conjunction with the accompanying drawings.
[0034] Figure 2a It is a three-dimensional schematic view of the chuck of the plasma processing equipment provided by the first embodiment of the present invention. Figure 2b It is a top view of the manipulator of the plasma processing equipment provided by the first embodiment of the present invention. Figure 2c for Figure 2b The manipulator shown transfers the workpiece to be machined Figure 2a Top view with chuck above shown. Please also refer to Figure 2a , Figure 2b and Figure 2c , The plasma processing equipment includes a carrying device and a conveying device. Wherein, the carrying device includes a chuck 20, which is used to carry the workpiece 40 to be processed when performing the process. ...
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The invention provides a plasma machining device which comprises a bearing device and a transmission device. The bearing device comprises a chuck used for bearing a machined workpiece when the technology is carried out, and the transmission device is used for transmitting the machined workpiece and comprises a mechanical arm. The machined workpiece is placed on the supper surface of the mechanical arm in a supporting mode, and the mechanical arm and the chuck relatively move in the vertical direction so as to place the machined workpiece on the upper surface of the chuck or move the machined workpiece away from the upper surface of the chuck. In addition, the mechanical arm comprises a body, the two ends of the body are provided with extension portions, and a concave space with one opened end is formed by the extension portions and the body. The chuck can penetrate through the concave space when moving relative to the mechanical arm in the vertical direction. The plasma machining device not only does not affect fixing and heating of the machined workpiece by the bearing device, but also can easily perform machining and is low in manufacturing cost. In addition, the process of bearing the machined workpiece by the plasma machining device is simple, and the machining efficiency is high.
Description
technical field [0001] The invention relates to the technical field of microelectronic processing, in particular to a plasma processing device. Background technique [0002] Plasma processing equipment is a common equipment for processing semiconductor devices, and it is mainly used to implement processes such as etching, sputtering and deposition. [0003] figure 1 It is a structural schematic diagram of the existing plasma processing equipment. Such as figure 1 As shown, the plasma processing equipment includes a process chamber 11 and a manipulator (not shown in the figure). An electrostatic chuck 12 is provided at the bottom of the process chamber 11 for carrying a wafer 14 . Moreover, the electrostatic chuck 12 adopts a multi-layer structure formed by stacking different materials such as metal (such as aluminum), tungsten electrodes, ceramics, and resistance wires, so as to realize functions such as fixing and heating the wafer 14 . Below the electrostatic chuck 12...
Claims
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IPC IPC(8): H01L21/677H01L21/683
Inventor 管长乐
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD