Compression joint type power module

A power module and crimping technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem of not being able to manufacture high-power crimping modules

Active Publication Date: 2013-12-04
SHENZHEN ESPIRIT TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In the crimping type power module, an annular inner groove is provided on the second surface of the casing, and an elastic buffer is embedded in it. During installation, the casing softly crimps the electrically insulating substrate through the elastic buffer, that is, the elastic buffer is A certain ela

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  • Compression joint type power module
  • Compression joint type power module
  • Compression joint type power module

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[0010] In order to make the objectives, technical solutions and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0011] See Figure 1 to Figure 4 The crimping type power module 10 provided by the embodiment of the present invention includes a housing 11, a cover plate 12, and an electrically insulating substrate 13 for crimping to the heat sink. The housing 11 has a first housing 11 opposite to the cover plate 12 and the electrically insulating substrate 13. A surface 111 and a second surface 112, the cover plate 12 and the electrically insulating substrate 13 are respectively mounted on the first surface 111 and the second surface 112 of the housing 11, and the second surface 112 of the housing 11 is a...

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Abstract

The invention provides a compression joint type power module which comprises a shell, a cover plate and an electric insulation substrate in compression joint with a cooling device. The shell is provided with a first surface and a second surface which are opposite to the cover plate and the electric insulation substrate respectively, the cover plate and the electric insulation substrate are assembled on the first surface and the second surface of the shell respectively, an annular inner groove is formed in the position of the second surface of the shell facing the periphery of the electric insulation substrate, a first elastic buffer part elastically abutted to the electric insulation substrate is embedded into the annular inner groove, and the first elastic buffer part is higher than the second surface of the shell so that the pressure of the electric insulation substrate in soft compression joint with the cooling device can be adjusted by the shell. As the elastic buffer part is embedded into the inner groove formed in the shell, a certain elastic buffer is provided, the electric insulation substrate can be protected from fracture, the pressure of the electric insulation substrate in soft compression joint with the cooling device can be adjusted, close compression joint of the electric insulation substrate and the cooling device is constantly ensured, heat resistance is reduced, and cooling efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of power electronics, in particular to a crimping type power module. Background technique [0002] At present, the crimping type power modules on the market now use the method of hard crimping between the shell and the electrical insulating substrate, because the electrical insulating substrate itself is relatively fragile, so in this type of design scheme, the surface area of ​​the electrical insulating substrate cannot be designed too large , otherwise there will be a danger of cracking the electrically insulating substrate during crimping, resulting in the power level of the hard crimping crimping power module not being designed too high, and it can only be used in small power modules. When the existing electrically insulating substrates are processed for chip welding, because the thermal expansion coefficient of the chips is different from that of the electrically insulating substrates, the electrically ...

Claims

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Application Information

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IPC IPC(8): H01L23/16
Inventor 张杰夫
Owner SHENZHEN ESPIRIT TECH
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