Drilling method and device for printed circuit board

Abstract

The present invention relates to a PCB drilling method including: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing backdrilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.

Description

technical field [0001] The present invention relates to the technical field of manufacturing printed circuit boards (Printed Circuit Board, PCB), in particular to a drilling method and device for printed circuit boards. Background technique [0002] With the rapid development of wireless and network communication technologies, the operating frequency of communication products is getting higher and higher, and the increase in operating frequency of communication products puts forward higher requirements for loss control in the transmission process. The back-drilling of the printed circuit board is a processing method that effectively reduces the loss of the hole link. The smaller the length of the redundant hole copper (Stub) above the signal layer after the back-drilling, the smaller the loss. [0003] Under the existing technology, the plated through hole (Plated Through Hole, PTH) is generally back-drilled according to the pre-calculated theoretical back-drilling depth; an...

AI Technical Summary

Problems solved by technology

Due to the uneven thickness of the PCB board, there are certain differences in the thickness of the same batch of PCB boards, even the thickness of different positions of the same PCB board is also different

The disadvantage of the existing technology is that the back-drilling depth obtained according to the test results of the conventional back-drilling Coupon position on the edge of the PCB deviates from the actual depth of the back-drilling position on the PCB, and the thicker the PCB, the greater the absolute value of the deviation , the greater the deviation of the back drilling depth

[0004] The functions realized by the PCB are becoming more and more complex, and the degree of integration is getting higher and higher. Correspondingly, the PCB board needs more layers and greater thickness to meet the functional design requirements of the PCB board, and through the above-mentioned PCB board edge and back drilling Coupon The deviation of the back-drilling depth obtained from the position test results is relatively large, which makes the length of the stub large, and the hole link loss has a great influence on high-frequency signal transmission.

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