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Inorganic adhesive for forming expanded silicate material and preparation method thereof

An inorganic adhesive and expanded silicate technology, applied in the field of high temperature resistant adhesives, can solve the problems of poor heat resistance, waterproof adhesion and other problems of adhesives, and achieve the effects of increasing the curing speed, improving the film-forming reaction, and enriching resources.

Active Publication Date: 2016-02-17
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an inorganic adhesive for forming expanded silicate materials and a preparation method thereof in order to solve the problems of poor heat resistance, water resistance and cohesiveness of the currently used adhesives

Method used

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  • Inorganic adhesive for forming expanded silicate material and preparation method thereof
  • Inorganic adhesive for forming expanded silicate material and preparation method thereof
  • Inorganic adhesive for forming expanded silicate material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Put the silica sol and lithium hydroxide powder into the reaction kettle at a weight ratio of 3:1, and mix and react at 60°C for 1h-1.5h under stirring to obtain a stable micro-emulsion white lithium silicate solution (the silicic acid used in the following reaction Lithium aqueous solution is prepared by this method).

[0032] Add 100 parts (parts by weight, the same below) of water glass with a modulus of 3.4 and 15 parts of lithium silicate aqueous solution into the reaction kettle and stir evenly, and the heating temperature is 65°C. Add 15 parts of silica sol and 2 parts of polyvinyl alcohol, and continue heating with stirring for 0.5-1h. Remove from heat and cool to room temperature. Then add 3 parts of waterproofing agent and 4 parts of curing agent (the curing agent is firstly ground by a ball mill to more than 1000 mesh), and stir evenly. The modulus of the adhesive is 3.4-3.6, the solid content is 38-41%, the Baume degree is 38-42, and the viscosity measured...

Embodiment 2

[0039] Add 100 parts (parts by weight, the same below) of water glass with a modulus of 3.4 and 10 parts of lithium silicate aqueous solution into the reaction kettle and stir evenly, and the heating temperature is 65°C. Add 20 parts of silica sol and 2 parts of polyvinyl alcohol, and continue heating with stirring for 0.5-1h. Remove from heat and cool to room temperature. Then add 3 parts of waterproofing agent and 4 parts of curing agent (the curing agent is firstly ground by a ball mill to more than 1000 mesh), and stir evenly. The modulus of the adhesive is 3.4-3.6, the solid content is 38-41%, the Baume degree is 38-42, and the viscosity measured by Tu-4 viscometer is 55-65s.

[0040] Put the prepared inorganic adhesive and extruded vermiculite into the mixer according to the mass ratio of 0.6:1, pour it into the mold after stirring evenly, hot press molding, demoulding, and wait until it is lowered to room temperature to obtain a fireproof insulation board . Its perfo...

Embodiment 3

[0046] Add 100 parts (parts by weight, the same below) of water glass with a modulus of 3.4 and 15 parts of lithium silicate aqueous solution into the reaction kettle and stir evenly, and the heating temperature is 65°C. Add 10 parts of silica sol and 2 parts of polyvinyl alcohol, and continue heating with stirring for 0.5-1h. Remove from heat and cool to room temperature. Then add 3 parts of waterproofing agent and 3.5 parts of curing agent (the curing agent is firstly ground by a ball mill to more than 1000 mesh), and stir evenly. The modulus of the adhesive is 3.4-3.6, the solid content is 38-41%, the Baume degree is 38-42, and the viscosity measured by Tu-4 viscometer is 55-65s.

[0047] Put the prepared inorganic adhesive and extruded vermiculite into the mixer according to the mass ratio of 0.6:1, pour it into the mold after stirring evenly, hot press molding, demoulding, and wait until it is lowered to room temperature to obtain a fireproof insulation board . Its per...

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Abstract

The invention relates to an inorganic adhesive used for the shaping of a swelling silicate material, and a preparation method of the inorganic adhesive and belongs to the field of high-temperature resisting adhesives. The inorganic adhesive comprises 95% to 96% of glue, 2% to 3% of curing agent and 1.5% to 2.5% of waterproof agent according to mass percent. The prepared inorganic adhesive used for swelling silicate fire-resistant insulation boards has the advantages that the raw material resource is rich and economical, the inorganic adhesive is nontoxic and harmless, does not contain volatile organic compound and is environmental-friendly; besides, a prepared swelling silicate fire-resistant insulation board does not release free formaldehyde and belongs to environmental-friendly material; the swelling silicate fire-resistant insulation board prepared from the inorganic adhesive prepared through the invention is high in mechanical strength and good in water resistance, and can resist high temperature, and the burning performance can reach the national fire-resistant standard level A; flue gas that is harmful to human health is not generated under high-temperature combustion.

Description

technical field [0001] The invention relates to an inorganic adhesive, in particular to an inorganic adhesive for molding expanded silicate materials and a preparation method thereof, belonging to the field of high-temperature-resistant adhesives. Background technique [0002] Expanded silicate fireproof and thermal insulation materials are widely used in industrial and civil buildings, and can be used for fireproof door cores, external wall thermal insulation materials and interior decoration, etc. Expanded silicate fireproof insulation board is generally made of adhesive and expanded silicate. Now part of the production of expanded silicate fireproof insulation boards is added with organic adhesives, such as phenolic resin, urea-formaldehyde resin, etc. Although the bond strength is enhanced, formaldehyde will be continuously released during the process of manufacture and use, which is harmful to human health. Moreover, organic adhesives are flammable, poor in heat resist...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B12/04C04B12/00
Inventor 刘吉平刘凯
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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