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Spray head, vapor deposition device and method for replacing thermal wallboard

A technology of chemical vapor deposition and spray head, which is applied in the direction of gaseous chemical plating, metal material coating process, coating, etc., can solve the problems of polluting reaction gas, affecting the quality of film layer, and decomposing, so as to achieve the goal of improving quality Effect

Inactive Publication Date: 2013-12-18
光垒光电科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The substance will decompose during the deposition process of the next cycle, thereby contaminating the reaction gas in the reaction chamber and affecting the quality of the film layer

Method used

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  • Spray head, vapor deposition device and method for replacing thermal wallboard
  • Spray head, vapor deposition device and method for replacing thermal wallboard
  • Spray head, vapor deposition device and method for replacing thermal wallboard

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Embodiment Construction

[0041] In the shower head in the prior art, a thermal wall plate spaced apart from the shower head body is arranged under the shower head body. After the hot wall plate performs multiple deposition cycles, a thick layer of material will be deposited on the surface of the hot wall plate. The substances will be decomposed during the deposition process of the next cycle, thereby polluting the reaction gas in the reaction chamber and affecting the quality of the film layer.

[0042] The inventor further researched and found that the thermal wall plate is fixed under the shower head body through the fastening action of several fastening mechanisms, and the fastening mechanism can be released by a manipulator inserted into the reaction chamber , so that the thermal wall plate is separated from the shower head body, the thermal wall plate can be easily installed on the shower head body through the snap-fit ​​mechanism, and the The hot wall plate is unloaded from the shower head body...

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PUM

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Abstract

The invention discloses a spray head. The spray head comprises a spray head body, at least one gas chamber, a cooling chamber and thermal wallboards, wherein the thermal wallboards are arranged below the spray head body at intervals and are fixed below the spray head body by the locking of a plurality of locking mechanisms; the locking mechanisms can be unlocked through a manipulator stretching into a reaction chamber so that the thermal wallboards are separated from the spray head body. The invention further provides a vapor deposition device containing the spray head and a method for replacing the thermal wallboards of the vapor deposition device. According to the spray head provided by the invention, the locking mechanisms can be locked or unlocked through the manipulator so as to mount the thermal wallboards on the spray head body or dismount the thermal wallboards from the spray head body, and therefore, the thermal wallboards can be replaced automatically and conveniently.

Description

technical field [0001] The invention relates to the technical field of semiconductor equipment, in particular to a shower head, vapor deposition equipment and a method for replacing a hot wall plate. Background technique [0002] The basic growth process of chemical vapor deposition, such as metalorganic chemical vapor deposition (MOCVD) process, is to introduce the reaction gas from the gas source into the reaction chamber, and use the substrate heated by the heater to initiate a chemical reaction, thereby forming a single crystal thin film on the substrate . During the MOCVD process, the reactants required for film growth rely on gas transportation (such as flow and diffusion) to reach the growth surface, and chemical reactions also occur during the transportation process, and finally the growth particles are combined into the film through adsorption and surface reactions. lattice. [0003] In the existing process, the corresponding reaction gas is usually provided by th...

Claims

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Application Information

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IPC IPC(8): C23C16/455C23C16/18C23C16/44
Inventor 周仁
Owner 光垒光电科技(上海)有限公司