Copper foil for printed wiring board, process for preparing the same, and printed wiring board using the copper foil

A technology of printed circuit boards and copper foils, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit parts, etc., can solve the problems of poor adhesion, difficulty in forming copper wiring patterns, and longer etching time, etc., to achieve adhesion Good contact effect

Active Publication Date: 2013-12-25
MITSUBISHI GAS CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, the etching time required to remove the copper foil (seed layer) from the surface of the insulating base becomes longer
In addition, as the etching time becomes longer, the amount of decrease in the line width of the copper wiring pattern increases, so it becomes difficult to form a fine copper wiring pattern.
[0010] On the

Method used

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  • Copper foil for printed wiring board, process for preparing the same, and printed wiring board using the copper foil
  • Copper foil for printed wiring board, process for preparing the same, and printed wiring board using the copper foil
  • Copper foil for printed wiring board, process for preparing the same, and printed wiring board using the copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0080] In Example 1, first, an electrolytic copper foil having a thickness of 12 μm and a size of 150 mm×150 mm was prepared. Next, the glossy surface of the prepared electrodeposited copper foil is etched. The composition and etching conditions of the etching liquid composition are as follows. Here, the glossy surface refers to the surface on the side contacting the roll-shaped cathode among both surfaces of the electrolytic copper foil.

[0081] ・Composition of etching liquid composition

[0082] Hydrogen peroxide: 0.5% by mass

[0083] Sulfuric acid: 2% by mass

[0084] 1H-tetrazole: 0.1% by mass

[0085] Chloride ion: 0.5ppm

[0086] · Etching conditions

[0087] Temperature of liquid composition for etching: 30°C

[0088] Injection pressure: 0.1MPa

[0089] Spray time: 1 minute

[0090] Next, the etched copper foil surface was observed with a scanning tunneling microscope at a magnification of 30000 times. figure 1 is a three-dimensional image of the copper foil...

Embodiment 2

[0129] In Example 2, the test similar to Example 1 was performed except having changed the liquid composition used for the etching process of the glossy surface of an electrolytic copper foil as follows.

[0130] ・Composition of etching liquid composition

[0131] Hydrogen peroxide: 0.5% by mass

[0132] Sulfuric acid: 2% by mass

[0133] 5-Methyltetrazole: 0.1% by mass

[0134] Chloride ion: 1ppm

[0135] The surface area in the region of 5 μm in length×5 μm in width of the copper foil surface after etching was measured. As a result, the surface area of ​​the copper foil is 44.7 [μm 2 ].

[0136] The surface roughness (Rzjis: ten-point height of microscopic unevenness) of the copper foil after etching was measured. As a result, the surface roughness of the copper foil was 0.5 [μm].

[0137] The adhesion enhancement coefficient E was calculated based on the above general formula (1). As a result, the coefficient of adhesion enhancement E was 3.58. The calculation form...

Embodiment 3

[0143] In Example 3, the test similar to Example 1 was performed except having changed the liquid composition used for the etching process of the glossy surface of an electrolytic copper foil as follows.

[0144] ・Composition of etching liquid composition

[0145] Hydrogen peroxide: 1% by mass

[0146] Sulfuric acid: 2.5% by mass

[0147] 5-Methyltetrazole: 0.05% by mass

[0148] 1,5-Dimethyltetrazole: 0.05% by mass

[0149] Chloride ion: 1ppm

[0150] The surface area in the region of 5 μm in length×5 μm in width of the copper foil surface after etching was measured. As a result, the copper foil has a surface area of ​​38 [μm 2 ].

[0151] The surface roughness (Rzjis: ten-point height of microscopic unevenness) of the copper foil after etching was measured. As a result, the surface roughness of the copper foil was 0.25 [μm].

[0152] The adhesion enhancement coefficient E was calculated based on the above general formula (1). As a result, the coefficient of adhesion...

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Abstract

The present invention provides a copper foil for a printed wiring board, a process for preparing the same, and the printed wiring board using the copper foil. The coper foil for the printed wiring board has high adhesion with an insulating substrate, and furthermore can be easily eliminated from the surface of insulating substrate through etching. The value of an adhesion reinforcement coefficient E represented by a general formula (1) of at least one surface of the printed wiring board of the invention is 2.5-8, E=(surface area of the copper foil)/(ten point heights of microscopic roughness on the surface of the copper foil) (1); wherein, the surface area of the copper foil is an average surface area of a unit area with a size of 1 mu m*1 mu m on the copper foil, and the surface area of the copper foil is a value which is obtained when the surface of the copper foil is observed through a scanning tunnel microscope.

Description

[0001] related application [0002] This application is an application accompanied by a claim of priority under the Paris Convention based on Japanese Patent Application No. 2012-128737. Therefore, this application includes all the matters disclosed in the Japanese patent application. technical field [0003] This invention relates to the copper foil for printed wiring boards. More specifically, it is related with the copper foil for printed wiring boards used for electronic equipment etc., its manufacturing method, and the printed wiring board which used the said copper foil. Background technique [0004] In recent years, along with miniaturization, weight reduction and high performance of electronic equipment, there is a strong demand for finer wiring patterns of printed circuit boards. The printed circuit board is used for, for example, a semiconductor mounting substrate, a motherboard substrate, and the like. [0005] Conventionally, subtractive methods and semi-additi...

Claims

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Application Information

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IPC IPC(8): H05K1/09H05K3/38C23F1/14C23F1/18
CPCH05K1/09H05K3/06H05K3/108H05K3/381
Inventor 高桥健一池田和彦
Owner MITSUBISHI GAS CHEM CO INC
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