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Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies

一种脉冲重复频率、激光直接的技术，应用在激光焊接设备、焊接设备、焊接/焊接/切割物品等方向，能够解决增大图案密度、影响产能等问题

Active Publication Date: 2014-01-01
ELECTRO SCI IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case of direct writing using UV YAG lasers, increasing pattern density can significantly impact throughput

Method used

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  • Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
  • Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies
  • Laser direct ablation with picosecond laser pulses at high pulse repetition frequencies

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Embodiment Construction

[0023] I. Overview

[0024] Systems and methods provide high throughput processing with high throughput (eg, using vector scanning methods) in laser direct ablation (LDA) applications. High-speed beam positioning and high pulse repetition frequency (PRF) provide sufficient continuous laser pulse overlap to control the uniformity and character of kerf cuts in dielectric materials. Known electroplating processes can then be used to form electrical paths in the cutouts with desired signal propagation characteristics (eg, impedance, resistance, and capacitance).

[0025] In certain embodiments, a high-speed beam positioning scheme is used in conjunction with a mode-locked laser. With the development of beam positioning technology, the pulse repetition rate of the laser source becomes the limiting factor. For example, the erosion size (one laser spot and The distance between one laser spot) is 10 μm or more. Therefore, in this example, there is no pulse overlap, and the laser b...

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Abstract

Laser direct ablation (LDA) produces patterns cut into a dielectric layer for the formation of electrically conductive traces with controlled signal propagation characteristics. LDA processing includes selecting a dose fluence for removing a desired depth of material along a scribe line on a surface of a workpiece, selecting a temporal pulsewidth for each laser pulse in a series of laser pulses, and selecting a pulse repetition frequency for the series of laser pulse. The pulse repetition frequency is based at least in part on the selected temporal pulsewidth to maintain the selected dose fluence along the scribe line. The selected pulse repetition frequency provides a predetermined minimum overlap of laser spots along the scribe line. The LDA process further includes generating a laser beam including the series of laser pulses according to the selected dose fluence, temporal pulsewidth, and pulse repetition frequency.

Description

technical field [0001] The present disclosure relates to laser micromachining. In particular, the present disclosure relates to systems and methods for scribing patterns in a workpiece to form conductive traces with controlled signal propagation characteristics. Background technique [0002] Integrated circuit (IC) substrate fabrication techniques aim to reduce substrate size and cost and increase functionality. A recent development uses laser direct ablation (LDA) and special plating processes to form electrical signal traces or pathways within the dielectric layer, rather than using traditional photolithographic techniques to form signal traces on the surface of the dielectric layer . The embedded trace approach reduces total layer count, improves cost and yield, and increases electrical performance by reducing signal length and optimizing trace routing. The method of embedded traces can be realized by forming signal traces with a width of 10 μm or less combined with a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301H01L21/28
CPCB23K26/0652B23K26/367B23K26/063B23K26/0807B23K2201/42B23K26/0861B23K26/0648B23K26/4065B23K26/0622B23K26/082B23K26/364B23K2103/42B23K2103/50B23K2101/42H01L21/28H01L21/30
Inventor 穆翰莫德·E·阿尔帕伊松本久马克·A·昂瑞斯李光宇
Owner ELECTRO SCI IND INC
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